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# Integration Engineer Development EoPM

- **Company:** ON Semiconductor Corporation
- **Location:** Hopewell Junction, NY, United States
- **Experience:** Expert
- **Salary:** $114,000.0 - $193,700.0
- **Contract:** Permanent contract
- **Skills:** Microsoft Word, Microsoft Excel, Data Analysis, Failure Mode Effects Analysis, Microsoft Project, Minitab, Microsoft PowerPoint, Coupa Supplier Portal, Statistical Process Control (SPC), JMP (Statistical Software), Yield Optimization
- **Published:** July 17, 2026
- **Apply:** https://www.indeed.com/viewjob?jk=db1c18c1261facc5

## About the Role

+ Power FET experience, Power Module experience.
 + Experience with copper plating and wafer thinning is a plus.
 + Key skills/experience for this position are Pick-and-place, sintering, CSP, and advanced packaging.
 + Additional skills/experience for this position are RDL, advanced packaging integration, polyimide, dicing, and module assembly.
 * Data Analysis & Tools:
 + Proficiency in MS Excel, PowerPoint, Word, and MS Project.
 + Skilled in yield analysis tools such as Shiny, Excensio, JMP, Minitab, etc.
 + Automation processing software such as SiView.
 * Cross-Functional Collaboration:
 + Work effectively within a global matrixed team and independently drive projects to completion.
 + Communicate clearly with all levels of the organization, including executive leadership.
 * Execution & Leadership:
 + Operate independently, translating high-level objectives into detailed execution plans.
 + Act as a team player with strong listening skills, able to incorporate input and make informed decisions., * Education: BS in Engineering or Materials Science, MS+ preferred
 * Experience: 6-10 years or more of relevant experience in semiconductor manufacturing integration and technology development.
 * Familiar with 5S, 8D, 6-sigma, SPC, DOE, FMEA
 * Language Fluency - Fluent in English Language, written & verbal

## Description

* New Product Development: Support product development from initial design through full-scale manufacturing, ensuring complete documentation for ONSEMI's process change review process.
 * Process Optimization: Collaborate with Manufacturing Engineering to recommend and implement manufacturable process recipes that meet yield and reliability targets.
 * Technical Expertise:
 + Demonstrate understanding of semiconductor technology, device physics, yield improvement, and manufacturing processes.
 + Novel Insulator integration into wafer packaging.


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