> Markdown version of [/jobs/ext/1340524-3d-heterogeneous-integration-design-enablement-engineer-2026-new-college-graduate](https://www.wearedevelopers.com/jobs/ext/1340524-3d-heterogeneous-integration-design-enablement-engineer-2026-new-college-graduate). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # 3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate) - **Company:** Globalfoundries U.S. Inc. - **Location:** Malta, NY, United States - **Experience:** Starter - **Salary:** $79,100.0 - $145,800.0 - **Contract:** Internship / Graduate position - **Skills:** Adobe InDesign, Linux Virtual Server, Integration Frameworks - **Published:** July 18, 2026 - **Apply:** https://www.disabledperson.com/jobs/73734348-3d-heterogeneous-integration-design-enablement-engineer-2026-new-college-graduate ## About the Role * Education - PhD with completed defended thesis or Master's in Electrical Engineering and Materials Science or related field from an accredited degree program. * Must have at least an overall 3.0 GPA and proven good academic standing. * Language Fluency - English (Written & Verbal). * Travel - Up to 10%. Preferred Qualifications: * Prior-related internship or co-op experience in design or EDA/design enablement * Fundamental knowledge of semiconductor packaging process modules and integration. * Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. * Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. * Strong written and verbal communication skills. * Strong planning & organizational skills. ## Description GlobalFoundries Fab8 is seeking a motivated R&D design enablement engineer to become part of our state-of-the-art 300mm fabrication facility in Malta, New York. This role will entail 3D heterogeneous integration (3DHI) design enablement to enable our next-generation advanced packaging R&D efforts, which include wafer-to-wafer bonding, die-to-wafer bonding, TSV/TOV and interposer development. Essential Responsibilities: * Publish Design Manual (DM) specifications based on failure modes identified for packaging required by the product lines in partnership with the unit process and R&D engineers. * DM is a collection of all technology restrictions (geometry rules, electrical rules, etc.) that must be followed for an integrated circuit (IC) design to be manufacturable. * Advanced packaging liaison to the DM and PDK (Process Design Kit) teams to translate packaging requirements to a device enablement specification covering: design rules, library device(TSV) layouts, layout vs schematic(LVS) requirements, device model terminals. * Develop expertise in drafting test vehicle content specifications and the associated tapeout process (including mask reviews). * Develop expertise in drafting test specifications for test vehicle content (macros); engage with the test teams (inline and lab) to ensure alignment on test requests. * Collaborate with vendors and OSATs (Outsourced Assembly and Test) on design (test vehicles, masks). * Facilitate advanced packaging design interactions between the product lines/fab teams and customers. * Work and collaborate with other teams regarding different assignments as needed. Other Responsibilities: * Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. * Other duties as assigned by manager. ## Related Videos - [Strange New Worlds: shaping the future of the digital age](https://www.wearedevelopers.com/videos/677-strange-new-worlds-shaping-the-future-of-the-digital-age) - [A Journey from Internal Tools to Public SDK](https://www.wearedevelopers.com/videos/1013-a-journey-from-internal-tools-to-public-sdk) - [Server Side Serverless in Swift](https://www.wearedevelopers.com/videos/133-server-side-serverless-in-swift) - [More efficient software for more efficient microchips](https://www.wearedevelopers.com/videos/1164-more-efficient-software-for-more-efficient-microchips) - [Why make use of an integration platform in today's software developments and infrastructure?](https://www.wearedevelopers.com/videos/758-why-make-use-of-an-integration-platform-in-today-s-software-developments-and-infrastructure) - [Kubernetes Security - Challenge and Opportunity](https://www.wearedevelopers.com/videos/412-kubernetes-security-challenge-and-opportunity) ## Related Articles - [Where to Find Entry-Level Software Engineering Jobs](https://www.wearedevelopers.com/magazine/397-where-to-find-entry-level-software-engineering-jobs) - [Where To Find Software Engineering Jobs](https://www.wearedevelopers.com/magazine/396-where-to-find-software-engineering-jobs) - [Résumé-Driven Development: How IT trends affect the job market for software developers](https://www.wearedevelopers.com/magazine/59-resume-driven-development-how-it-trends-affect-the-job-market-for-software-developers) - [7 Important Tips That Every Software Developer Should Know](https://www.wearedevelopers.com/magazine/101-7-important-tips-that-every-software-developer-should-know) - [System change: restart as developer?](https://www.wearedevelopers.com/magazine/39-system-change-restart-as-developer) - [It's hot, it's new, it's our first print magazine](https://www.wearedevelopers.com/magazine/22-it-s-hot-it-s-new-it-s-our-first-print-magazine)