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# Yield and Integration Engineer

- **Company:** Teledyne Technologies Incorporated
- **Location:** Goleta, CA, United States
- **Experience:** Experienced
- **Salary:** $113,600.0 - $151,400.0
- **Contract:** Permanent contract
- **Skills:** Analysis of Variance (ANOVA), Computer Programming, Information Engineering, Data Mining, R (Programming Language), Python (Programming Language), MATLAB, Statistical Process Control (SPC), SQL Databases, JMP (Statistical Software), Yield Optimization
- **Published:** July 23, 2026
- **Apply:** https://dejobs.org/x/x/F426F7DE5B3945598DDE1F5CE62EF51E/job/

## About the Role

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins., Under the supervision of the Detector Yield and Data Engineering Manager, collects, tracks and analyzes process and metrology data from a variety of sources to inform and guide team's design and process yield improvement activities. A significant aspect of this position also includes direct involvement in device failure analysis. Will need to collaborate with team members and other contributors across the spectrum of relevant disciplines and levels of authority. Ability to work effectively in a high performance team environment, including demonstrated strong interpersonal and communications skills. A flexible, self-motivated, results oriented mindset is essential.

In support of data mining, analysis and reporting role, ideal candidate will have some experience in:

 * Semiconductor wafer processing
 * Programming skills in: Python, Matlab, R, JMP, or similar
 * SQL database query experience
 * Statistical Process Control (SPC)

In support of Failure Analysis and yield improvement, ideal candidate will have some experience in:

 * Structured problem-solving methods (Kepner Tregoe, DMAIC, 8D, 6-sigma, etc.)
 * Design of Experiments (DOE/ANOVA)
 * Optical microscopy
 * SEM/FIB
 * Profilometry, ellipsometry, X-Section, wafer stress
 * Other elemental analysis methods (TOF-SIMS, EDX, & Auger)
 * Other fault isolation techniques (FIBedit, OBIRCH/TIVA, IR, & curve trace)

Other desired experience/knowledge areas:

 * Wafer processing (photo, etch, dep, clean, CMP, inspection, etc.)
 * Vacuum technology and equipment
 * Infrared Imaging
 * Hermetic packaging (solder, seam seal, wirebond, WLP, die attach, leak testing, etc.)

Required:

 * BS in engineering or a science, M.S. preferred
 * 2+ years as a Process, Design, Quality or Manufacturing Engineer
 * Ability to work in cleanroom environment.



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