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# System Thermal Engineer - AI and Compute Server Development

- **Company:** Tech Data
- **Location:** Fremont, CA, United States
- **Experience:** Expert
- **Salary:** $181,000.0 - $240,000.0
- **Contract:** Permanent contract
- **Skills:** Adobe InDesign, Artificial Intelligence, Airflow, Computational Fluid Dynamics, Software Debugging, Software Tools, Data Analytics, Network Server
- **Published:** July 23, 2026
- **Apply:** https://synnex.wd5.myworkdayjobs.com/hyvecareers/job/Fremont-CA/System-Thermal-Engineer---AI-and-Compute-Server-Development_R54176

## About the Role

* Education: Bachelor's or Master's in Mechanical Engineering, Thermal Engineering, or a related discipline.
 * Experience: 8+ years of hands-on thermal design experience for servers, GPU platforms, or high-power electronics, including system bring-up and validation. Exposure to liquid cooling and hyperscale deployments preferred.
 * Technical expertise: Solid working knowledge of airflow and thermal design, heatsinks and cold plates, CFD/thermal modeling tools, and lab instrumentation and measurement techniques.
 * Working style: Hands-on problem solver comfortable in lab environments, with the ability to turn thermal data into practical design changes and communicate clearly across teams.

Compensation: $ 181,000 to $240,000

## Description

@HYVE Solutions, missions to help customers, business partners, and employees achieve success through shared goals, strategies, resources and technology solutions.

As a Staff-level System Thermal Engineer, you will execute hands-on thermal design and validation for Hyve's next-generation AI and compute servers, working alongside the Principal thermal lead and cross-functional hardware teams. You will design and test air-cooled and liquid-cooled solutions, run thermal and CFD analysis, and support bring-up and production ramp to ensure platforms meet performance, reliability, and manufacturability targets.

Core Responsibilities

 * System thermal design. Develop and optimize airflow paths, heatsinks, cold plates, and fan/ducting solutions for high-power GPU, CPU, VR, and memory components across air-cooled and liquid-cooled platforms.
 * Thermal modeling and analysis. Perform CFD and thermal simulations to guide component placement, system layout, and cooling margin evaluation under worst-case workloads and environmental conditions.
 * Lab validation. Instrument systems with temperature, flow, and pressure sensors; execute thermal characterization, stress testing, and margin validation, and correlate results with simulation.
 * Bring-up and debug. Support thermal bring-up during EVT/DVT/PVT, debug hotspots and airflow/flow inefficiencies, and help drive corrective actions through factory ramp.
 * Cross-functional execution. Collaborate with mechanical, hardware, power, and manufacturing teams to embed thermal requirements into board layouts, mechanical stackups, and rack packaging, and participate in design reviews with data-driven recommendations.


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