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Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # System Mechanical & Integration Engineer - **Company:** Analog Devices - **Location:** Wilmington, MA, United States - **Experience:** Experienced - **Salary:** $110,385.0 - $151,808.0 - **Contract:** Internship / Graduate position - **Skills:** Computer-Aided Design, Artificial Intelligence, Data Analysis, Computer Aided Three-Dimensional Interactive Application (CATIA), Computational Fluid Dynamics, SolidWorks (CAD), Data Centers, Document Management Systems, Failure Mode Effects Analysis, Python (Programming Language), MATLAB, Rapid Prototyping Process, Release Management, Software Reliability Testing, Systems Integration, AI Infrastructure, Cloud Platform System, High Performance Computing, Creo, Ansys, Server Operating Systems & Platforms - **Published:** July 24, 2026 - **Apply:** https://www.oriontalent.com/search-jobs/career/11632404/system-mechanical-integration-engineer-massachusetts-ma-wilmington ## About the Role * MS or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Electrical Engineering, or a related field. * 3+ experience with Strong foundation in multiple areas spanning: + Mechanical design and product development + Thermal management of electronic systems + System integration of power electronics platforms + Candidates with additional experience may be considered at the Senior Engineer level * Demonstrated experience (research, projects, internships, or industry) developing mechanical and thermal solutions for electronic products, power systems, or high-performance computing infrastructure. * Experience with CAD tools such as Creo, SolidWorks, NX, or CATIA. * Experience performing thermal simulations, CFD analysis, or airflow optimization for electronics cooling applications. * Understanding of structural mechanics, tolerance analysis, material selection, and manufacturing processes. * Knowledge of high-current power distribution methods including busbars, connectors, grounding, creepage, and clearance requirements. * Strong analytical and problem-solving skills with a hands-on approach to design validation and troubleshooting., * Industry experience with data center power supplies, server platforms, rack-level power systems, renewable energy, or energy storage systems. * Experience designing high-power systems (>3 kW), power shelves, >400V power conversion platforms, or AI infrastructure hardware. * Proficiency with thermal simulation tools such as ANSYS Icepak, Fluent, FloTHERM, 6SigmaET, or Star-CCM+. * Experience with liquid-cooling technologies including cold plates, CDU integration, direct-to-chip cooling, and rack-level thermal management. * Knowledge of power electronics packaging including magnetic components, power semiconductors, busbar design, and EMC/EMI considerations. * Familiarity with mechanical reliability testing including vibration, shock, HALT/HASS, and environmental qualification. * Experience with DFM, DFA, FMEA, GD&T, tolerance stack-up, and production release processes. * Python or MATLAB experience for thermal data analysis, automation, and model correlation. * Strong communication skills and ability to work effectively in multidisciplinary engineering teams. ## Description Analog Devices' High Voltage & Protection team is seeking a Systems Integration Engineer to support the development of next-generation data center power delivery solutions. In this role, you will work alongside experienced power electronics, thermal, mechanical, systems, and reliability engineers to design, integrate, and validate high-density power supply systems for AI and cloud computing infrastructure. The focus will be on mechanical architecture development, thermal management, enclosure design, busbar integration, manufacturability, and system-level validation of high-power server and rack-level power solutions. Key Responsibilities In this role, your focus will be on hands-on mechanical and thermal development of power systems, with ownership commensurate with level and increasing responsibility over time. * Design and integrate mechanical subsystems for high voltage power conversion platforms, including HV DC/DC module, intelligent power system, and Power Distribution Box (PDB). * Own enclosure and structural design activities, including sheet metal design, die-cast components, machined parts, fastening strategies, tolerance stack-up analysis, manufacturability, and assembly considerations. * Develop thermal solutions for high-power electronic systems utilizing air cooling, liquid cooling, cold plates, heat sinks, vapor chambers, heat spreaders, and advanced thermal interface materials. * Perform thermal simulations and airflow analysis using industry-standard tools (Icepak, Fluent, 6SigmaET, FloTHERM, Star-CCM+, or equivalent) to optimize cooling performance and maintain component reliability. * Design and validate power interconnect solutions including busbars, copper current-carrying structures, high-current connectors, grounding systems, and electrical isolation features. * Collaborate closely with electrical and power electronics teams to optimize mechanical packaging of transformers, inductors, capacitors, semiconductors, and magnetic components. * Create and execute thermal, mechanical, vibration, shock, and environmental validation plans to ensure compliance with product and customer requirements. * Support prototype builds, design verification testing (DVT), and root-cause analysis of thermal, structural, or assembly-related issues. * Work with manufacturing partners, suppliers, and contract manufacturers to develop cost-effective, scalable, and production-ready mechanical solutions. * Document system architecture, design analyses, simulations, test results, and lessons learned to support product development and continuous improvement. ## Related Videos - [Leveraging Large Language Models for Legacy Code Translation: Challenges and Solutions](https://www.wearedevelopers.com/videos/1157-leveraging-large-language-models-for-legacy-code-translation-challenges-and-solutions) - [Cloud Vendor Lock-In - Is it just a new version of the Database Abstraction Layers?](https://www.wearedevelopers.com/videos/1185-cloud-vendor-lock-in-is-it-just-a-new-version-of-the-database-abstraction-layers) - [More efficient software for more efficient microchips](https://www.wearedevelopers.com/videos/1164-more-efficient-software-for-more-efficient-microchips) - [Building a hypercar from scratch](https://www.wearedevelopers.com/videos/607-building-a-hypercar-from-scratch) - [Software stack under and over the hood of the fastest accelerating car in the world](https://www.wearedevelopers.com/videos/221-software-stack-under-and-over-the-hood-of-the-fastest-accelerating-car-in-the-world) - [Colorful quantum randomness](https://www.wearedevelopers.com/videos/100257-colorful-quantum-randomness) ## Related Articles - [How to Become an AI Engineer](https://www.wearedevelopers.com/magazine/331-how-to-become-an-ai-engineer) - [The Most Popular IT Jobs on the Market](https://www.wearedevelopers.com/magazine/376-the-most-popular-it-jobs-on-the-market) - [From developer to manager – what does it take to become an engineering manager?](https://www.wearedevelopers.com/magazine/42-from-developer-to-manager-what-does-it-take-to-become-an-engineering-manager) - [Is Software Engineering Hard?](https://www.wearedevelopers.com/magazine/448-is-software-engineering-hard) - [Top Characteristics of a Software Engineer](https://www.wearedevelopers.com/magazine/166-top-characteristics-of-a-software-engineer) - [What is Software Engineering?](https://www.wearedevelopers.com/magazine/289-what-is-software-engineering)