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# R&D Package Design and Signal Integrity

- **Company:** Keysight Technologies
- **Location:** Colorado Springs, CO, United States
- **Experience:** Expert
- **Salary:** $153,600.0 - $192,000.0
- **Contract:** Permanent contract
- **Skills:** Network Planning and Design, Signal Integrity, Application Specific Integrated Circuits
- **Published:** July 25, 2026
- **Apply:** https://jobs.localjobnetwork.com/apply/add/87038341/1

## About the Role

* BS or MS degree in Electrical Engineering or equivalent
 * Minimum 7+ years of experience (MS and 5 years) in hardware/circuit design, RF/microwave design, high-frequency modeling/optimization, or high-power density design
 * Proven experience with semiconductor, packaging, and printed circuit board technologies, associated materials, manufacturing processes, and design methodologies
 * Excellent understanding of Electrical Engineering principles, Signal Integrity, RF/Microwave theory, and high frequency circuit design methodologies
 * Strong knowledge of thermodynamics and thermostructural analysis principles
 * Excellent understanding of materials science principles
 * Familiarity with IC design methodologies, processes, and workflows preferred

## Description

You'll collaborate across global teams to design, optimize, and implement ASIC packaging and subsystem solutions that meet test & measurement product functionality, performance, quality and schedule requirements. This role is part of Keysight Laboratories, a world-renowned technology organization which enables Keysight to be first to market with breakthrough products and solutions.

 * ASIC package, module, and subsystem development including layout, integration, SI/PI analysis, and power delivery network design
 * Modeling & optimization of high-frequency RF and high-speed digital I/O interconnects
 * Close collaboration with system, IC design, and test teams to develop and define hardware architecture, requirements, functionality, and performance
 * Identification of appropriate packaging technologies for each chip design and investigation of next generation industry solutions
 * Support for instrument product development to enable integration of critical ASIC blocks
 * Collaboration with internal and external supply chain manufacturing partners to identify, develop, deploy, and execute new processes
 * Collaboration with the test & reliability teams in the characterization and qualification of each ASIC
 * Lifecycle support for existing ASIC components


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