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# Sr Staff Package Design Engineer

- **Company:** RENESAS ELECTRONICS AMERICA INC.
- **Location:** Tempe, AZ, United States
- **Experience:** Expert
- **Contract:** Permanent contract
- **Skills:** Package Development Process, Statistical Process Control (SPC)
- **Published:** July 26, 2026
- **Apply:** https://dejobs.org/x/x/E964356474294623B01044C0BE879F50/job/

## About the Role

* Doctorate/Masters / Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
 * 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
 * Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.
 * Strong interpersonal and communication skills.
 * Strong analytical and presentation skills.

## Description

* Design and develop package and interconnect methods for Renesas's packaging needs in the areas of Power SiP/modules, WLCSP, multi-chip module with substrate or embedded die/capacitor and power device packaging.
 * Develop Cu RDL with seed layer on IC wafer and FET and Backside metal deposit after grinding
 * Wafer thinning development through Taiko BG and Glass carrier bond
 * Define substrate, die interconnection through via, materials and PCB interface requirements
 * Package technologies qualification for consumer & industrial power as well as automotive power applications.
 * Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
 * Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
 * Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
 * Resolve all process integration issues by ensuring all window checks are done on critical process steps.
 * Establish production controls and monitor to ensure there is no room for quality incidents.
 * Ensure smooth transition into production & implement ramp up monitor.
 * Work with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer.
 * Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging & flip chip interconnects in LGA.
 * Participate in packaging roadmap development & focus on execution.
 * Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.
 * Establish & maintain package design rules


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