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# semiconductor Package Reliability Engineer

- **Company:** Altera Corporation
- **Location:** San Jose, CA, United States
- **Experience:** Expert
- **Salary:** $166,900.0 - $240,000.0
- **Contract:** Permanent contract
- **Skills:** Abaqus, Data Analysis, Comsol Multiphysics, Python (Programming Language), Package Development Process, Scripting, Ansys
- **Published:** July 19, 2026
- **Apply:** https://www.dice.com/job-detail/173cba43-10ce-4191-a9a2-164a94a9c300

## About the Role

* Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or a related technical field with 8+ years of experience in semiconductor package thermal and thermomechanical analysis
 * 8+ years of experience using thermal and thermomechanical simulation tools (e.g., Ansys, Abaqus, COMSOL, or equivalent) to develop and analyze warpage, coplanarity, stress, and deformation models for advanced semiconductor packages.
 * 8+ years of experience developing, analyzing, and validating advanced semiconductor packaging technologies, including 2.5D, 3D, and heterogeneous integration packages, with a strong understanding of package reliability.
 * 3+ years of experience applying reliability statistics, failure analysis methodologies, and lifetime modeling techniques to semiconductor packaging and product reliability assessments.
 * 3+ years of experience developing scripts or software using Python for automation, simulation workflows, data analysis, and post-processing.

Preferred Qualifications

 * Deep understanding of thermal, mechanical and thermomechanical characteristics of advanced 2.5D/3D flip-chip packages
 * Ability to correlate between thermomechanical simulations and package dynamic warpage and package behavior in surface mount system level assembly
 * Develop customer facing collaterals for packaging risk assessments

## Description

We are seeking an experienced semiconductor Package Reliability Engineer responsible for characterizing and qualifying advanced 2.5D/3D semiconductor packages. This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical characterization for advanced packaging technologies.


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