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# Staff Equipment Development Engineer - Advanced...

- **Company:** Micron Technology, Inc.
- **Location:** Boise, ID, United States
- **Experience:** Experienced
- **Contract:** Permanent contract
- **Skills:** Data Analysis, Failure Mode Effects Analysis, Hardware Design, Statistical Process Control (SPC)
- **Published:** July 22, 2026
- **Apply:** https://www.juju.com/job/00000000gjqaaj

## About the Role

+ Master's Degree or equivalent experience in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields

 + 2+ years of semiconductor process or equipment engineering experience

 + Fundamental understanding of post probe and assembly process and equipment interactions.

 + Understanding of related inline/electrical/probe failure.

 + 2+ years of experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis

 + Ability to resolve sophisticated issues through root-cause or model-based problem solving and a focus on meeting commitments

 + Hands on experience with wafer / assembly tools and overlay systems

Preferred Qualifications:

 + Ph.D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related technical field, or equivalent experience

 + Knowledge of robotics, machine logic language, or new hardware design is desirable.

 + Wafer or die bonding, plating, warpage control and packaging field experience preferable.

## Description

As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment. You will take ideas from conception through development to implementation in APTD and manufacturing facilities. Responsibilities include identifying, diagnosing, and resolving equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology. You will also coordinate and carry out equipment evaluation/optimization, lead improvement and cost reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes. You will become a domain expert, crafting technology roadmaps and influencing Micron's leadership in semiconductor manufacturing.

Responsibilities:

 + Develop strategies and implement to improve Equipment maturity for (FOAK) hardware.

 + Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing. Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron's products.

 + Optimizing equipment to reduce cost, increase availability, and improve hardware and process capability.

 + Collaborating with process development teams to develop innovative new solutions.

 + Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions.

 + Performing fundamental research to drive innovative solutions for next-generation equipment products.

 + Support equipment transfer to production facilities (some domestic or international travel may be required).


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