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# Director, Chiplets/FCBGA Integration

- **Company:** Amkor Technology
- **Location:** Tempe, AZ, United States
- **Experience:** Expert
- **Contract:** Permanent contract
- **Skills:** Package Development Process, Statistical Process Control (SPC)
- **Published:** August 4, 2026
- **Apply:** https://www.indeed.com/viewjob?jk=bfb3ac04314661e3

## About the Role

* Bachelor's Degree in Engineering, with Mechanical Engineering or Materials Science preferred. A Master's degree is a plus.
 * 10+ years of experience in semiconductor package development is required, with direct experience in IC Packaging.
 * The qualified candidate understands the IC package design environment, and tradeoffs associated with package design during process development of FCBGA packages.
 * A working knowledge of mechanical stress/strain and IC package warpage is required.
 * Deep knowledge of IC packaging materials, failure modes and reliability qualification procedures is required.
 * Excellent written and verbal communication skills are needed.
 * This position requires 10-20% travel including domestic and international travel., * Expertise in high-density fan-out (HDFO) or bridge-like chiplet module constructions, constraints and tradeoffs.
 * Mechanical or Thermal simulation experience.
 * Familiarity with Design of Experiments and Statistical Process Control.

## Description

Amkor is currently seeking a Director, Chiplets and FCBGA for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based IC Packages including HDFO (High Density Fan-out) and other advanced IC Package constructions for Computing, Networking and Mobile market spaces. This person will be the primary interface with Tier 1 customers and Amkor's leading edge R&D center in South Korea., * Drive and coordinate development activities with customers, in conjunction with Amkor's R&D development teams in Korea.

 * Lead Tier 1 customer interface meetings, discussions and follow-up actions during the project development phase.
 * Manage a cross-functional team with all Amkor resources as required to execute the project in a timely manner, including R&D, Design, Characterization and Simulation teams.
 * Manage customer product management through the development phase and into initial production ramp.


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