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# 3D-IC Application Engineer

- **Company:** Siemens AG
- **Location:** Austin, TX, United States
- **Experience:** Experienced
- **Contract:** Permanent contract
- **Skills:** Vbscript, Microsoft Windows, Computer Programming, Linux, Perl (Programming Language), Python (Programming Language), Tcl (Programming Language), Verilog, Linux Virtual Server
- **Published:** August 9, 2026
- **Apply:** https://us.experteer.com/career/view-jobs/3d-ic-application-engineer-austin-tx-usa-58867567

## About the Role

Experteer Overview In this role you help win technical design bets for Siemens EDA by partnering with leading semiconductor manufacturers. You will present, demo, and benchmark products to demonstrate value and drive market share. You'll prototype and integrate 3DIC flows, collaborating with global teams to deliver effective solutions. This role blends hands-on engineering with consultative sales in a hybrid work environment. Compensation / Benefits * secure technical design wins for Siemens EDA offerings * deliver technical presentations and product demonstrations * conduct benchmarks and develop account strategies to gain market share * prototype 3DIC solution flows and integration scripts * collaborate with cross-functional teams and stakeholders * travel domestically and internationally as needed Tasks * MSEE/BSEE with 4+ years design experience * strong IC package layout design experience * experience with IC design is a plus * knowledge of IC package design tools (Cadence
APD/SiP, Siemens Xpedition/i3DL) * practical experience from design setup to manufacturing docs * familiarity with 2.5D/3D chiplet design solutions * familiarity with IC data formats (Verilog, LEF/DEF, GDS, OASIS) * experience with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS) * experience with Calibre DRC/LVS and 3DSTACK is desirable * scripting/programming skills (VBS, Python, Tcl, Perl) * Windows and Linux OS experience * prior Applications Engineer experience preferred Key requirements * hybrid work model * health and wellness benefits * global collaboration with 377,000+ minds * competitive compensation * diversity and inclusion * career growth opportunities

## Description

Experteer Overview In this role you help win technical design bets for Siemens EDA by partnering with leading semiconductor manufacturers. You will present, demo, and benchmark products to demonstrate value and drive market share. You'll prototype and integrate 3DIC flows, collaborating with global teams to deliver effective solutions. This role blends hands-on engineering with consultative sales in a hybrid work environment. Compensation / Benefits * secure technical design wins for Siemens EDA offerings * deliver technical presentations and product demonstrations * conduct benchmarks and develop account strategies to gain market share * prototype 3DIC solution flows and integration scripts * collaborate with cross-functional teams and stakeholders * travel domestically and internationally as needed Tasks * MSEE/BSEE with 4+ years design experience * strong IC package layout design experience * experience with IC design is a plus * knowledge of IC package design tools (Cadence APD/SiP, Siemens Xpedition/i3DL) * practical experience from design setup to manufacturing docs * familiarity with 2.5D/3D chiplet design solutions * familiarity with IC data formats (Verilog, LEF/DEF, GDS, OASIS) * experience with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS) * experience with Calibre DRC/LVS and 3DSTACK is desirable * scripting/programming skills (VBS, Python, Tcl, Perl) * Windows and Linux OS experience * prior Applications Engineer experience preferred Key requirements * hybrid work model * health and wellness benefits * global collaboration with 377,000+ minds * competitive compensation * diversity and inclusion * career growth opportunities


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