> Markdown version of [/jobs/ext/2013459-3d-heterogeneous-integration-engineer](https://www.wearedevelopers.com/jobs/ext/2013459-3d-heterogeneous-integration-engineer). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # 3D Heterogeneous Integration Engineer - **Company:** Globalfoundries U.S. Inc. - **Location:** Malta, MT, United States - **Experience:** Experienced - **Salary:** $98,000.0 - $176,000.0 - **Contract:** Permanent contract - **Skills:** Adobe InDesign, Data Analysis, Internet Protocol, Package Development Process, Systems Integration, Enterprise Application Integration - **Published:** August 10, 2026 - **Apply:** https://www.careerbuilder.com/job-details/3d-heterogeneous-integration-engineer-malta-ny--6a29d0b6-18b9-47e4-b33f-8887182dfed0 ## About the Role * Education- Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. * MS degree with at least 5 years of prior related work experience. * In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly. * Strong problem solving and technical trouble shooting skills including expertise in design of experiment. * Must have at least an overall 3.0 GPA and proven good academic standing. * Language Fluency- English (Written & Verbal). * Travel- Up to 10%., * Education- PhD education level preferred with at least 3 years of prior related work experience. * Demonstrated prior leadership experience internally or with an OSAT eco-system. * Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. * Strong written and verbal communication skills. * Strong planning and organizational skills., Chemical Engineering, Communication Skills, Compensation and Benefits, Data Analysis, Ecosystems, Electrical Engineering, English Language, Enterprise Application Integration (EAI), Environmental Health, Experiment Design, Federal Laws and Regulations, IP (Internet Protocol), Identify Issues, Leadership, Machine Tool, Manufacturing, Manufacturing Engineering, Material Science, Mechanical Engineering, Medical Conditions, Mentoring, Organizational Skills, Presentation/Verbal Skills, Problem Solving Skills, Process Development, Process Engineering, Project/Program Management, Prototyping Programming Languages, Research & Development (R&D), Safety Training, Safety/Work Safety, Semiconductors, State Laws and Regulations, System Integration (SI), Testing, Willing to Travel, Writing Skills ## Description * Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.). * Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs. * Collaborate joint development projects (JDP) with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes. * Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs. * Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources. * Drive data analysis, interpretation of results, and understanding of failure modes. * Identify and resolve process integration issues and related challenges. * Generate IP related to novel wafer integration and packaging technology. Other Responsibilities: * Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. * Participate in hiring activities. * Mentor and guide new hires to assume their roles and responsibilities. * Other duties as assigned by manager. ## Related Videos - [More efficient software for more efficient microchips](https://www.wearedevelopers.com/videos/1164-more-efficient-software-for-more-efficient-microchips) - [Small, Secure, Interconnected: The next Internet Protocol](https://www.wearedevelopers.com/videos/100062-small-secure-interconnected-the-next-internet-protocol) - [Data Science in Retail](https://www.wearedevelopers.com/videos/586-data-science-in-retail) - [Strange New Worlds: shaping the future of the digital age](https://www.wearedevelopers.com/videos/677-strange-new-worlds-shaping-the-future-of-the-digital-age) - [Brewing Tea over the Internet](https://www.wearedevelopers.com/videos/697-brewing-tea-over-the-internet) - [Data Science on Software Data](https://www.wearedevelopers.com/videos/162-data-science-on-software-data) ## Related Articles - [Where to Find Entry-Level Software Engineering Jobs](https://www.wearedevelopers.com/magazine/397-where-to-find-entry-level-software-engineering-jobs) - [Is Software Engineering Over-Saturated?](https://www.wearedevelopers.com/magazine/418-is-software-engineering-over-saturated) - [Where To Find Software Engineering Jobs](https://www.wearedevelopers.com/magazine/396-where-to-find-software-engineering-jobs) - [Top-Paying Tech Jobs (with Salaries)](https://www.wearedevelopers.com/magazine/372-top-paying-tech-jobs-with-salaries) - [How Much FAANG Companies Actually Pay Software Engineers in 2025](https://www.wearedevelopers.com/magazine/230-how-much-faang-companies-actually-pay-software-engineers-in-2025) - [A Guide to Green Tech and Green IT Careers](https://www.wearedevelopers.com/magazine/374-a-guide-to-green-tech-and-green-it-careers)