> Markdown version of [/jobs/ext/2102979-3d-heterogeneous-integration-engineer](https://www.wearedevelopers.com/jobs/ext/2102979-3d-heterogeneous-integration-engineer). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # 3D Heterogeneous Integration Engineer - **Company:** Globalfoundries U.S. Inc. - **Location:** Malta, NY, United States - **Experience:** Experienced - **Salary:** $98,000.0 - $176,000.0 - **Contract:** Permanent contract - **Skills:** Adobe InDesign, Data Analysis, Package Development Process - **Published:** August 18, 2026 - **Apply:** https://www.disabledperson.com/jobs/74353240-3d-heterogeneous-integration-engineer ## About the Role * Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. * MS degree with at least 5 years of prior related work experience. * In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly. * Strong problem solving and technical trouble shooting skills including expertise in design of experiment. * Must have at least an overall 3.0 GPA and proven good academic standing. * Language Fluency - English (Written & Verbal). * Travel - Up to 10%., * Education - PhD education level preferred with at least 3 years of prior related work experience. * Demonstrated prior leadership experience internally or with an OSAT eco-system. * Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. * Strong written and verbal communication skills. * Strong planning and organizational skills. ## Description * Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.). * Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs. * Collaborate joint development projects (JDP) with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes. * Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs. * Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources. * Drive data analysis, interpretation of results, and understanding of failure modes. * Identify and resolve process integration issues and related challenges. * Generate IP related to novel wafer integration and packaging technology. Other Responsibilities: * Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. * Participate in hiring activities. * Mentor and guide new hires to assume their roles and responsibilities. * Other duties as assigned by manager. ## Related Videos - [How AWS Generates Polyglot Libraries Based on a Single TypeScript Codebase](https://www.wearedevelopers.com/videos/1026-how-aws-generates-polyglot-libraries-based-on-a-single-typescript-codebase) - [Data Science in Retail](https://www.wearedevelopers.com/videos/586-data-science-in-retail) - [Your next 10x engineer isn't in your city. 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