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# ASIC Package SI/PI Engineer

- **Company:** OpenAI Inc.
- **Location:** San Francisco, CA, United States
- **Experience:** Expert
- **Salary:** $266,000.0
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Signal Integrity, Application Specific Integrated Circuits, Hfss, Ansys
- **Published:** August 20, 2026
- **Apply:** https://diversityjobs.com/main/sendform/8/8/28176/1/18013048?backUrl=%2Fcareer%2F18013048%2FAsic-Package-Si-Pi-Engineer-California-San-Francisco

## About the Role

* 5+ years of experience in signal integrity, power integrity, high-speed interconnect design, PDN design and package electrical design.
 * Strong understanding of signal-integrity and power-integrity fundamentals, including transmission-line behavior, impedance, loss, crosstalk, return paths, power-distribution networks, inductance, decoupling, voltage droop, and current distribution.
 * Hands-on experience with electromagnetic and SI/PI simulation tools such as Synopsys HSPICE, Ansys EDT, HFSS-PI, SIwave, Cadence Clarity, Sigrity PowerSI/PowerDC, or equivalent.
 * Experience with package layout environments such as Cadence APD/SIP, including the ability to review and modify package structures for SI/PI optimization.
 * Experience developing automated design optimization flows for model extraction, simulation setup, post-processing, design-space exploration, or layout optimization.
 * Strong communication skills and the ability to work effectively across ASIC, package, PCB, system, mechanical, thermal, power, validation, and manufacturing teams.

Preferred Qualifications

 * Hands-on experience with advanced 2.5D/3D packaging, silicon or organic interposers, bridge technologies, HBM integration, IVR integration, or large-body AI/HPC packages.
 * Experience developing early-stage SI/PI feasibility methodologies that support chip and package architecture decisions.
 * Experience with memory architecture and high-speed memory interfaces, including HBM and DDR/LPDDR.
 * Experience with high-speed laboratory validation using VNA, spectrum analyzers, TDR/TDT, high-bandwidth oscilloscopes, and probe-based measurements.
 * Knowledge of package and PCB material properties, including dielectric constant, loss tangent, copper roughness, and manufacturing variation.

To comply with U.S. export control laws and regulations, candidates for this role may need to meet certain legal status requirements as provided in those laws and regulations.



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