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Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Director, Package Development Engineering - **Company:** Sitime Corporation - **Location:** Santa Clara, United States - **Experience:** Expert - **Salary:** $238,950.0 - **Contract:** Permanent contract - **Skills:** Micro Electro-Mechanical Systems (MEMS), Package Development Process, Signal Integrity, Yield Optimization - **Published:** August 20, 2026 - **Apply:** https://www.dice.com/job-detail/12fdea6f-3bd3-460a-8e6a-624a5d71f0ad ## About the Role * Education: Ph.D. or Master's degree in Mechanical Engineering, Materials Science, Microelectronics, or Physics. * Experience: 10+ years of experience in semiconductor packaging R&D, with at least 5 years leading teams focused on advanced heterogeneous integration. * Technical Depth: Expertise in semiconductor materials, process integration, process engineering and metrology. Develop workflows with EDA tool chains and calibrating measurements to attain predictive performance. Implement automated process control strategies to ensure volume manufacturability and quality. * OSAT/Foundry Management: Demonstrated expertise in collaborating with OSATs and semiconductor foundries. Understand differences between different supplier capabilities to establish an OSAT-specific execution framework. * Global Teams: Experience in managing high-performance, geographically distributed teams with centers of excellence, local decision autonomy and strong teamwork. * Leadership: Strong cross-functional leadership, problem-solving and communication skills., * Strategic technology leader with the ability to define a differentiated packaging vision and translate it into executable roadmaps, milestones, and measurable business outcomes. * Deep technical curiosity and innovation mindset, with a demonstrated drive to challenge conventional packaging approaches and solve complex thermal, mechanical, materials, and manufacturability problems. * Hands-on technical credibility; able to engage at depth with engineers, suppliers, OSATs, and executives while balancing architecture, execution, quality, yield, and cost tradeoffs. * Strong collaborator and influencer who can align cross-functional teams across MEMS, IC design, process technology, product engineering, operations, quality, and external partners. * Global leadership capability, including success building and leading high-performing teams across the U.S., Taiwan, and partner locations with clear accountability and strong operating cadence. * Partner-development mindset, with the ability to build trusted, technically rigorous relationships with OSATs, foundries, equipment vendors, and materials suppliers. * Execution-oriented problem solver who thrives in ambiguity, drives rapid issue resolution, and applies structured root-cause analysis to reduce technical and program risk. * Customer and product impact orientation, with an understanding of how packaging choices affect system performance, reliability, manufacturability, supply resilience, and competitive differentiation. * High standards for engineering discipline, including data-driven decision-making, robust qualification methods, design-for-manufacturing, process control, and continuous improvement. * Talent builder and coach who attracts, develops, and retains exceptional technical talent while creating a culture of ownership, collaboration, innovation, and accountability. * Entrepreneurial and resourceful mindset, comfortable operating in a fast-paced growth environment where priorities evolve and leaders are expected to move from strategy to hands-on problem solving. * Clear executive communicator able to simplify complex technical topics, articulate tradeoffs, and influence decisions with senior leadership and external partners. ## Description SiTime seeks a seasoned leader to drive its packaging technology. This individual will drive the execution of SiTime's innovative packaging roadmap. SiTime's packaging leverages conventional and advanced wafer scale packaging technologies to create thermally and mechanically stable environments for co-packaged MEMs. The successful candidate will have expertise in leading innovative teams, incorporating new materials, and a track record of collaborating closely with development partners. A curiosity to transcend the status quo is welcome and silicon process technology development experience is a strong plus, * Packaging Roadmap & Architecture: Define the packaging roadmap that creates the technical capabilities to enable product performance, form-factor, reliability and cost. Define package requirements and target assembly flows aligned to quality and reliability specifications. * OSAT Development Collaboration: Lead technical relationships with OSAT partners to align and implement SiTime's packaging roadmap. Build and manage local teams at key OSAT sites to accelerate development velocity and transfer to production. Manage key issues and risk burn down in the design, NPI, qualification and volume phases. Develop yield improvement and supply increase plans. * Mechanical Design: Oversee design, analysis and characterization for fit, thermal performance, structural stability, die stress, vibration immunity, and manufacturability. * Electrical Interface Optimization: Collaborate with IC design teams to optimize parasitic capacitance, resistance, and signal integrity. * Advanced Material Characterization: Drive selection and qualification of substrates, die-attach materials, underfills, and mold compounds in alignment with suppliers. * Packaging Laboratory: Drive workflows to accelerate screening of alternative materials and characterization of package performance and reliability. * Productivity: Define best practices and manage KPI metrics for all aspects of package development process and package lifecycle. * Team Leadership: Track record of talent and leadership development of engineers and technicians to create high-performance, execution-focused teams. ## Related Videos - [Angular Signals: what's all the fuss about?](https://www.wearedevelopers.com/videos/684-angular-signals-what-s-all-the-fuss-about) - [Quantum Tech: Preparing for the Next Leap](https://www.wearedevelopers.com/videos/1693-quantum-tech-preparing-for-the-next-leap) - [How AWS Generates Polyglot Libraries Based on a Single TypeScript Codebase](https://www.wearedevelopers.com/videos/1026-how-aws-generates-polyglot-libraries-based-on-a-single-typescript-codebase) - [The Billion Dollar Machine: First Time Right.](https://www.wearedevelopers.com/videos/393-the-billion-dollar-machine-first-time-right) - [Robust AIGC Provenance with Invisible Watermarking](https://www.wearedevelopers.com/videos/100222-robust-aigc-provenance-with-invisible-watermarking) - [Successful talent development: A joint journey of executives and talents](https://www.wearedevelopers.com/videos/1002-successful-talent-development-a-joint-journey-of-executives-and-talents) ## Related Articles - [How We Built a Worry-Free System That Runs for 10+ Years – And What We’d Do Again](https://www.wearedevelopers.com/magazine/751-how-we-built-a-worry-free-system-that-runs-for-10-years-and-what-we-d-do-again) - [From developer to manager – what does it take to become an engineering manager?](https://www.wearedevelopers.com/magazine/42-from-developer-to-manager-what-does-it-take-to-become-an-engineering-manager) - [Top Characteristics of a Software Engineer](https://www.wearedevelopers.com/magazine/166-top-characteristics-of-a-software-engineer) - [Résumé-Driven Development: How IT trends affect the job market for software developers](https://www.wearedevelopers.com/magazine/59-resume-driven-development-how-it-trends-affect-the-job-market-for-software-developers) - [Data Science & more: The Lopez dilemma](https://www.wearedevelopers.com/magazine/10-data-science-more-the-lopez-dilemma) - [Now is the time for industrialized software development](https://www.wearedevelopers.com/magazine/601-now-is-the-time-for-industrialized-software-development)