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Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Technical Lead Package Platform Engineer - **Company:** Astera Labs - **Location:** San Jose, CA, United States - **Experience:** Expert - **Salary:** $160,000.0 - $200,000.0 - **Contract:** Permanent contract - **Skills:** Package Development Process, Release Management, Strategies of Testing, Yield Optimization - **Published:** August 25, 2026 - **Apply:** https://www.dice.com/job-detail/16cdb8a6-2786-49ca-92d9-049801204fbb ## About the Role * Strong experience in FCBGA assembly manufacturing processes and laminate substrate technologies. * Proven NPI development experience for advanced flip-chip packages, from early package definition through qualification and production release. * Experience with package implementation from die netlist to flip-chip package design and manufacturing. * Demonstrated experience managing substrate suppliers and assembly OSAT partners. * Strong technical project management skills, including schedule and milestone management, technical risk assessment, issue resolution, and cross-functional execution. * Demonstrated ability to lead and collaborate across Product Engineering, Program Management, Quality, Marketing, Design, and external supplier teams. * Experience managing and resolving customer returns and field quality issues related to semiconductor packaging, particularly package assembly processes, material quality, and supplier workmanship. * Strong problem-solving skills with experience in root cause analysis, failure analysis, containment, corrective actions, and recurrence prevention. Preferred Qualifications * Experience with Cadence Allegro Package Designer (APD) or equivalent package design tools. * Strong knowledge of FCBGA package reliability mechanisms, test methodologies, and qualification requirements. * Experience developing and executing qualification plans for FCBGA packages. * Experience with system-level reliability assessment of large-body FCBGA packages. ## Description We are seeking a Lead Package Engineer to drive the development, qualification, and manufacturing of advanced FCBGA packages. This role will drive package development from concept through NPI, qualification, and high-volume manufacturing, with strong ownership of technical execution, supplier management, project management, and package-related customer quality issues. The successful candidate will work closely with package design, Product Engineering, Program Management, Quality, Marketing, substrate suppliers, and assembly OSAT partners to deliver robust, manufacturable, and reliable package solutions., * Lead FCBGA package NPI development from concept and die netlist through package design, assembly development, qualification, and production release. * Provide technical leadership in FCBGA assembly manufacturing processes and laminate substrate technologies. * Manage technical execution with substrate suppliers and assembly OSAT partners, including schedule, quality, manufacturing readiness, yield improvement, and issue resolution. * Lead technical project management activities, including project planning, milestone tracking, risk assessment and mitigation, issue escalation, and cross-functional execution. * Collaborate with Package Design, Product Engineering, Program Management, Quality, Marketing, and other internal teams to ensure successful product development and launch. * Lead package reliability assessment and qualification planning for FCBGA products, including large-body packages. * Support system-level reliability assessment and risk mitigation for large-size FCBGA packages. * Lead investigation and resolution of customer returns and field quality issues related to package assembly processes, materials, and workmanship quality. * Drive root cause analysis, failure analysis, containment, corrective actions, and recurrence prevention in collaboration with internal teams, material suppliers, substrate suppliers, and OSAT partners. * Support package and substrate warpage characterization, analysis, and improvement, including the impact of materials, package architecture, and assembly processes. * Contribute technical expertise to advanced packaging technologies, including Co-Packaged Optics (CPO) and Near-Packaged Optics (NPO). ## Related Videos - [How to govern Vibe Coding for the Enterprise](https://www.wearedevelopers.com/videos/100290-how-to-govern-vibe-coding-for-the-enterprise) - [Quantum Tech: Preparing for the Next Leap](https://www.wearedevelopers.com/videos/1693-quantum-tech-preparing-for-the-next-leap) - [Your Testing Strategy is broken - lets fix it!](https://www.wearedevelopers.com/videos/1672-your-testing-strategy-is-broken-lets-fix-it) - [More efficient software for more efficient microchips](https://www.wearedevelopers.com/videos/1164-more-efficient-software-for-more-efficient-microchips) - [How to Survive The Worst Launch of Your Career with Brenda Romero](https://www.wearedevelopers.com/videos/609-how-to-survive-the-worst-launch-of-your-career-with-brenda-romero) - [Overcoming bottlenecks of Platform Teams](https://www.wearedevelopers.com/videos/1410-overcoming-bottlenecks-of-platform-teams) ## Related Articles - [How We Built a Worry-Free System That Runs for 10+ Years – And What We’d Do Again](https://www.wearedevelopers.com/magazine/751-how-we-built-a-worry-free-system-that-runs-for-10-years-and-what-we-d-do-again) - [Why Attend a Developer Event in 2026?](https://www.wearedevelopers.com/magazine/688-why-attend-a-developer-event-in-2026) - [What Makes WeAreDevelopers World Congress Different From Every Other Tech Event?](https://www.wearedevelopers.com/magazine/701-what-makes-wearedevelopers-world-congress-different-from-every-other-tech-event) - [From developer to manager – what does it take to become an engineering manager?](https://www.wearedevelopers.com/magazine/42-from-developer-to-manager-what-does-it-take-to-become-an-engineering-manager) - [Dev Digest 121 - AI goes offline](https://www.wearedevelopers.com/magazine/456-dev-digest-121-ai-goes-offline) - [Dev Digest 132 - Binging WADFlix?](https://www.wearedevelopers.com/magazine/473-dev-digest-132-binging-wadflix)