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# Asic Engineer

- **Company:** Actalent
- **Location:** Broomfield, CO, United States
- **Experience:** Experienced
- **Salary:** $140,000.0 - $240,000.0
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Automation of Tests, Spreadsheets, Application Specific Integrated Circuits, Pcb Layout
- **Published:** August 29, 2026
- **Apply:** https://www.techcareers.com/job.asp?id=3369521647&tx=JR8377FFJ&pt=1&aff=0B19D771-A501-4A5E-8338-2A822B784D54&utm_source=Job%20Feed&utm_medium=textkernel&utm_campaign=DE&utm_term=0B19D771-A501-4A5E-8338-2A822B784D54

## About the Role

* 12+ years of experience in flip-chip-BGA package design, including high-speed SerDes.
 * Minimum of 3 years in a management role.
 * Bachelor's or Master's degree in Electrical Engineering or a similar field.
 * Knowledge of package-level signal and power integrity.
 * Self-management and organizational skills.
 * Technical understanding of the package-design lifecycle, including .mcm, package spreadsheets, and drawings.

Additional Skills & Qualifications

 * Experience with layout, SI/PI extractions, and simulations.
 * Automation code development skills.
 * Mechanical and thermal modeling expertise.
 * Proficiency in project management.
 * Ability to understand skill sets and traits of team members to maximize productivity and retention.
 * Experience with new business quotes, power integrity, and PCB layout.

## Description

We are seeking an IC Package Design Manager to lead a team of engineers in designing complex flip-chip-BGA packages for industry-leading ASICs. These ASICs are vital for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. As part of a global R&D team, you will develop high-performance package designs featuring high-speed SerDes, 5G RF/Microwave ADC/DAC, HBM, DDR5, and more. Your role involves supporting and developing the engineering team, contributing to technical methodologies, and managing projects., * Lead and manage a team of 6-10 engineers, with potential for team growth.

 * Design complex flip-chip-BGA packages for ASICs with high-speed SerDes and high-power delivery needs.
 * Support the worldwide R&D team in developing high-performance package designs.
 * Contribute to the development of technical methodologies and project management.
 * Manage team and customer activities to ensure projects stay on track.
 * Create and track project plans for over 20 concurrent designs, managing scope, schedules, and resources.
 * Communicate plans, status updates, next steps, and risks effectively.
 * Steer package technology and design rules with input from team members.
 * Collaborate with customers, vendors, and cross-functional teams.


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