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# Director, System in Package Architecture

- **Company:** SK hynix
- **Location:** San Jose, CA, United States
- **Experience:** Expert
- **Salary:** $240,000.0 - $300,000.0
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Cloud Computing, Information Systems, Dynamic Random-Access Memory, Flash Memory, Design of User Interfaces, Human-Computer Interaction, Session Initiation Protocols, Machine Learning, Signal Integrity, Systems Architecture, Systems Integration, Computer Network Operations, Information Technology
- **Published:** August 30, 2026
- **Apply:** https://www.careerbuilder.com/job-details/director-system-in-package-architecture-san-jose-ca--ab7f3f29-6b0d-42b3-ab4a-037719b46128

## About the Role

* BS in Electrical Engineering or equivalent combination of education and progressive industry experience.
 * 7+ years of specialized experience in advanced packaging architecture definition, strategy, and development.
 * Demonstrated success in driving cross-functional alignment across engineering, product, and operations teams to deliver complex solutions.
 * Proven track record of leading, mentoring, and scaling high-performing engineering teams, with experience managing managers or team leads preferred.
 * Exceptional verbal and written communication skills, with the ability to articulate technical strategies., * Master's degree or PhD in Electrical Engineering, Materials Science, or related field.
 * 10+ years of experience in advanced packaging architecture, specifically with 2.5D and 3D packaging technologies.
 * Expert working knowledge of 2.5D/3D packaging technologies and large body substrate technologies.
 * Strong proficiency in Signal Integrity (SI) and Power Integrity (PI) analysis and optimization.
 * Direct experience in High Bandwidth Memory (HBM) architecture and integration is highly desirable., Analysis Skills, Artificial Intelligence (AI), Business Operations, Cloud Computing, Communication Skills, Cross-Functional, DRAM, Electrical Design, Electrical Engineering, Funding, Information Technology & Information Systems, Leading Edge Technology, Machine Learning, Material Science, Mechanical Testing, Memory Hardware, Mentoring, Mobile Technology, NAND Flash, Network Operations Center, Presentation/Verbal Skills, Product Packaging, Reimbursement, Research & Development (R&D), SIP (Session Initiation Protocol), Semiconductors, Signal Integrity, Smartphones, Sustainability, System Architecture, System Integration (SI), Team Lead/Manager, Technical Strategy, Test Design, User Interface/Experience (UI/UX), Writing Skills

## Description

* Lead the end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a specific focus on High Bandwidth Memory (HBM).
 * Drive mechanical and electrical test vehicle design and development when necessary.
 * Spearhead research and development of novel technologies to enhance SiP performance, driving the roadmap for SOC and HBM integration in 2.5D and 3D packaging environments.
 * Lead strategic collaborations with internal teams and external partners to ensure seamless technology development and time-to-market.


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