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Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Job Description Summary - **Company:** GE Vernova - **Location:** Findlay Township, United States - **Experience:** Expert - **Salary:** $113,200.0 - **Contract:** Permanent contract - **Skills:** Artificial Intelligence, Computational Fluid Dynamics, Comsol Multiphysics, Software Debugging, Rapid Prototyping Process, Subsystems, Windchill, Creo, Ansys - **Published:** August 9, 2026 - **Apply:** https://www.dice.com/job-detail/681a4faf-1262-4285-9b00-cf1c9ef08f4c ## About the Role * Engineering degree in Mechanical Engineering from an accredited university with an emphasis in mechanical design of electrical systems with at least 6+ years? experience in electrical engineering and/or power electronics packaging. * 10+ years (total experience) of experience in mechanical design for electrical equipment, conversion systems, and high-power applications. * 3+ years of experience with 3D mechanical design tools, including Windchill/Creo, ANSYS Workbench, ANSYS Electronics Desktop, COMSOL, ANSYS Mechanical, and Fluent, with the ability to apply these tools to complex converter systems. * 2+ years of experience with insulation standards, creepage and clearance requirements, and core principles of electronics packaging as it pertains to the mechanical design of Variable Frequency Drives (VFDs) and Power Electronic components such as PCBs. * 2+ years of designing enclosures for housing electronic equipment, ranging from individual modules to system level enclosures. Including knowledge of manufacturing and fabrication processes, such as machining, sheet metal fabrication, welded structures, etc. * 2+ years of experience performing mechanical analysis for power converter components, subsystems, and converter systems., * Additional experience in thermal analysis for electrical equipment, power converter components, subsystems, converter systems, and high-power applications. * Comprehensive understanding of military standards, such as MIL-DTL-917F, MIL-DTL-2036E, MIL-STD-1472, etc. Must be able to demonstrate clear knowledge of the specifications and know challenges and design features to enable compliance to the specifications. * Thorough understanding of DFM methodologies. * Proven track record of designing products tailored to meet military standards. * Excellent communication skills, articulate in simplifying complex problems * Ability to multi-task on a variety of projects to tight schedule. * Excellent hands-on debug skills, ability to get things to work. * Innovative and inventive in developing intellectual properties (IPs). * Willingness to learn, embrace, and utilize AI to enhance engineering and increase productivity. ## Description We are seeking a Senior Mechanical Engineer to lead the packaging, structural, and thermal design of next-generation high-power electrical systems, including inverters, converters, variable frequency drives, and energy storage solutions. This role sits at the intersection of electrical performance and physical implementation, with responsibility for developing cooling systems, enclosures, and packaging architectures for high-density power electronics operating in demanding environments. As part of the Advanced Concepts and Technology team, you will apply first-principles engineering, FEA/CFD modeling, rapid prototyping, and hands-on testing to solve complex challenges in heat transfer, structural integrity, electronics packaging, and manufacturability. The role supports advanced applications such as energy storage, propulsion systems, naval/marine power systems, and building block converters, including designs using SiC and GaN devices. This position requires deep expertise in mechanical integration, and product development, with a strong focus on practical, scalable, design-for-manufacturing solutions. You will also help strengthen the team through mentoring and training junior engineers., * Review customer requirements and developmechanical/thermal specificationsfor high-power converter systems acrossindustrial, marine, renewable, and navalapplications. * Leadsystem architecture and trade studiesthat influence component selection, materials, board layout, and packaging design. * Own thethermal management strategyfor power converters, includingheat sinks, cold plates, heat exchangers, and thermal interface materials. * Perform and guideFEA/CFD modelingto evaluate cooling performance, fluid flow, thermal balance, structural integrity, shock, vibration, and thermal stress. * Develop and validatecooling loop hardwareand thermal solutions formagnetics, power devices, and PCBsthrough testing, instrumentation, and simulation correlation. * Designelectromechanical assembliessuch as ruggedized enclosures, busbars, connectors, insulation systems, structural supports, and PCB mounting solutions for harsh environments. * Ensure designs meethigh-voltage safety, creepage/clearance, EMI, shock/vibration, and environmentalrequirements while balancingperformance, cost, and manufacturability. * Create and executetest plans, oversee prototype builds, perform lab-based validation, and correlate physical test data with simulation results. * DriveDesign for Manufacturability / Assembly (DFM/DFA), manage BOMs and technical documentation, and support manufacturing, sourcing, supplier quality, and final acceptance testing. * Collaborate acrosselectrical, systems, controls, manufacturing, and test teams, lead design reviews, and mentor junior engineers in mechanical and thermal design best practices. ## Related Videos - [Building a hypercar from scratch](https://www.wearedevelopers.com/videos/607-building-a-hypercar-from-scratch) - [Cloud Vendor Lock-In - Is it just a new version of the Database Abstraction Layers?](https://www.wearedevelopers.com/videos/1185-cloud-vendor-lock-in-is-it-just-a-new-version-of-the-database-abstraction-layers) - [More efficient software for more efficient microchips](https://www.wearedevelopers.com/videos/1164-more-efficient-software-for-more-efficient-microchips) - [Colorful quantum randomness](https://www.wearedevelopers.com/videos/100257-colorful-quantum-randomness) - [C# 13 Unleashed: Live Demos of my Top 10 Cutting-Edge Features!](https://www.wearedevelopers.com/videos/1225-c-13-unleashed-live-demos-of-my-top-10-cutting-edge-features) - [Remote Driving on Plant Grounds with State-of-the-Art Cloud Technologies](https://www.wearedevelopers.com/videos/251-remote-driving-on-plant-grounds-with-state-of-the-art-cloud-technologies) ## Related Articles - [How to Become an AI Engineer](https://www.wearedevelopers.com/magazine/331-how-to-become-an-ai-engineer) - [Highest Paying Tech Companies for Developers](https://www.wearedevelopers.com/magazine/220-highest-paying-tech-companies-for-developers) - [How software is steering vehicle technology](https://www.wearedevelopers.com/magazine/515-how-software-is-steering-vehicle-technology) - [A Guide to Green Tech and Green IT Careers](https://www.wearedevelopers.com/magazine/374-a-guide-to-green-tech-and-green-it-careers) - [How We Built a Worry-Free System That Runs for 10+ Years – And What We’d Do Again](https://www.wearedevelopers.com/magazine/751-how-we-built-a-worry-free-system-that-runs-for-10-years-and-what-we-d-do-again) - [How to Write a CV and Interview if You Don't Fully Qualify For The Job](https://www.wearedevelopers.com/magazine/183-how-to-write-a-cv-and-interview-if-you-don-t-fully-qualify-for-the-job)