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# Workstation Development Engineer, DRAM Wet Etch

- **Company:** Micron Technology, Inc.
- **Location:** Boise, ID, United States
- **Experience:** Experienced
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Dynamic Random-Access Memory, Failure Mode Effects Analysis, Statistical Process Control (SPC), Yield Optimization
- **Published:** May 19, 2026
- **Apply:** https://www.indeed.com/viewjob?jk=2152a846f1fb5aa7

## About the Role

* M.S. degree in Chemical Engineering, Chemistry, Material Science or related fields or equivalent industry experience paired with 3+ years of semiconductor industry experience.
 * Will have prior wet processing and/or chemistry experience in academia or within the semiconductor industry or related field
 * The ability to work independently under minimal supervision
 * Experience generating presentations and reports
 * The ability to work with others, both one-on-one and in a team environment, and to effectively organize, prioritize, and manage time
 * Qualified candidates should also have a good background in organic and inorganic chemistry, and knowledge of integrated circuit processing and semiconductor devices

Preferred Qualifications:

 * Must have strong verbal and written communication skills
 * Incorporation of AI into daily work role. Specific emphasis in coding, automation and/or data science.

## Description

As a Workstation and Transfer Engineer you will be primarily responsible for starting up and optimizing tool processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, risk management, workstation road mapping to enable new process development and coordinating transfer activities from TD to HVM. You will also be required to identify, diagnose and resolve process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives., * Recipe consolidation and efficiency improvements including sharing and implementing BKMs

 * Tool monitoring synergies
 * Release new tools and setting up redundancy
 * Share new methods and maintain BKMs on new processes
 * Maintain workstation configuration and segregation efficiency (roadmap)
 * Streamline quals and maintenance for toolsets
 * Engagement with HVM/MCT for global alignment
 * Transfer coordination to HVM


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