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# Principal CPU Architect - High-Performance And Physical Design Organization

- **Company:** NVIDIA Ltd.
- **Location:** Austin, TX, United States
- **Experience:** Expert
- **Salary:** $272,000.0
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Very-Large-Scale Integration, Cloud Computing, Computer Engineering, Microarchitecture, CPU Design, Performance Tuning, Software Architecture, System on a Chip, Data Processing, Graphics Processing Unit (GPU), Information Technology, Physical Design
- **Published:** August 23, 2026
- **Apply:** https://www.careerbuilder.com/job-details/principal-cpu-architect-high-performance-and-physical-design-austin-tx--f6e225a4-da9c-42cb-b2a8-c94ca0086958

## About the Role

* BS/MS in Electrical Engineering, Computer Science, Computer Engineering, or equivalent experience.
 * 15 or more years of relevant experience.
 * Extensive background in CPU architecture and high-frequency server CPU design.
 * Solid understanding of power dissipation, delivery, and efficiency concepts.
 * Detailed understanding of process technologies and circuit design.
 * Knowledge of tradeoffs related to advanced packaging techniques.
 * Well versed in power management techniques that span the entire stack from SW, Architecture, RTL, VLSI, and process.

Ways to stand out from the crowd:

 * PhD or research experience.
 * Advanced knowledge in the area of physical design.
 * Knowledge of GPU and SOC design.
 * Strong communication skills., Artificial Intelligence (AI), CPU (Central Processing Unit), Circuit Design, Cloud Computing, Communication Skills, Computer Engineering, Computer Science, Data Processing, Electrical Engineering, GPU (Graphics Processing Unit), Healthcare, Industry/Trade Analysis, Performance Tuning/Optimization, Power Management, Process Engineering, Process Improvement, RTL Design, Robotics, Software Architecture, Use Cases, VLSI

## Description

We are seeking a senior CPU architect with deep experience designing high-performance, high-frequency server-class processors. This role focuses on the interaction between CPU architecture, power-performance optimization, and physical design.

The successful candidate will understand how microarchitectural and RTL decisions translate into frequency, power delivery, timing, thermal, area, and implementation constraints. The role spans CPU architecture, RTL, standard-cell and circuit-level tradeoffs, physical design, process technology, and advanced packaging.

What you'll be doing:

 * Bridge the gap between architecture, RTL implementation, and physical design.
 * Serve as subject matter expert on power delivery/regulators, power gating, di/dt, and thermal throttling.
 * Analyze power trade-offs for different die stacking and packaging proposals.
 * Propose and drive improvements related to high-frequency design and power methodology for our custom CPU cores.


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