> Markdown version of [/jobs/ext/2473126-photonics-heterogeneous-integration-optical-interconnects-co](https://www.wearedevelopers.com/jobs/ext/2473126-photonics-heterogeneous-integration-optical-interconnects-co). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Photonics Heterogeneous Integration & Optical Interconnects Co - **Company:** Suny. The Research Foundation - **Location:** Rochester, NY, United States - **Salary:** $52,000.0 - **Contract:** Internship / Graduate position - **Skills:** 3d Models, Component-Based Software Engineering, PIC Microcontroller - **Published:** August 11, 2026 - **Apply:** https://jobs.military.com/career/307083/photonics-heterogeneous-integration-optical-interconnects-co-op-new-york-ny-rochester ## About the Role * Currently enrolled as a full-time student in a relevant undergraduate or graduate engineering program (microelectronics, mechanical, or materials) and has completed at least three years of their program if undergraduate.\n * Must be available for at least 6 months of continuous, full-time employment.\n * Basic understanding of photonics or optoelectronics concepts.\n * Strong written and verbal communication skills.\n, * Previous experience with photonic integrated circuits or optoelectronics\n * Previous experience with optical modeling software\n * Previous experience working with an optics table and free space optics\n ## Description This co-op will assist in the design, assembly, and test of the next generation of AIM Photonics TAP's heterogeneously integrated materials and optical interconnects, interfacing AIM's photonic integrated circuits to other optical components such as thin-film lithium niobate, lasers, and fiber optic cable. The student will assist in the design, fabrication, integration, and characterization of waveguides, photonic devices, micro-optics, and free space beams, including assisting with setup of deployment of needed equipment and processes. They will help create and update standard operating procedures and work instructions, support process qualifications, and assist with internal test vehicles and customer builds.\n \n This is an opportunity for the student to obtain hands-on experience with cutting-edge photonics design, test, and packaging in a foundry environment.\n \n \nKey Responsibilities\n \n \n * Integrate thin films and micro-optical elements into existing photonic integrated circuits using a variety of semiconductor assembly and metrology equipment including photolithography, chemistry benches, thin-film bonders, atomic force microscope, IR microscope, ellipsometer, etc.\n * Test assembled chips with photonics test equipment such as electrical and optical probe stations, optomechanical systems, optical backscatter reflectometer, among others.\n * Assist with the deployment of new equipment as needed.\n * Assist with the development of thin film coupons, thin film devices, and micro-optics for PIC integration as needed, using internal test vehicles.\n * Create and revise standard operating procedures and work instructions based on experience with the assembly equipment.\n * Gain familiarity with the foundry model and assist with component development and design guides for the TAP assembly design kit.\n * Assist with customer builds as needed.\n ## Related Videos - [Photonic Computing: Programming a New Class of AI Accelerators (incl. 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