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Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Senior Principal Engineer- SoC/Chip Lead - **Company:** Renesas Electronics America Inc. - **Location:** San Jose, CA, United States - **Experience:** Expert - **Salary:** $230,000.0 - $300,000.0 - **Contract:** Permanent contract - **Skills:** Artificial Intelligence, Computer Engineering, Data Centers, Extract Transform Load (ETL), Software Debugging, Logic Synthesis of Circuits, Ethernet, Firmware, Signal Integrity, Static Timing Analysis, Subsystems, Application Specific Integrated Circuits, Physical Design - **Published:** August 4, 2026 - **Apply:** https://www.indeed.com/viewjob?jk=81b7a0d7a0c97985 ## About the Role * Bachelor's, Master's, or Ph.D. in Electrical Engineering, Computer Engineering, or related discipline. * 20+ years of semiconductor industry experience with substantial leadership responsibility. * Proven experience as a Chip Lead, SoC Lead, Technical Program Lead, or equivalent role for large-scale ASIC/SoC products. * Demonstrated success leading advanced-node SoCs, preferably at 3nm and/or 5nm technology nodes. * Deep understanding of SoC architecture, integration methodologies, and full-chip development flows. * Strong experience working across: + RTL Design, Design Verification, Physical Design, DFT, Static Timing Analysis, Low-Power Design Methodologies and Silicon Bring-up and Productization. * Experience managing complex schedules, technical dependencies, and cross-functional execution across global teams. * Strong communication, stakeholder management, and engineering leadership skills. Preferred Qualifications: * Prior experience with: + High-performance switching silicon + Network-on-Chip (NoC) architectures + Data movement and interconnect fabrics + High-bandwidth memory-centric systems + Complex multi-die or chiplet-based architectures * Hands-on experience integrating: + High-speed SerDes interfaces, Analog front-end (AFE) subsystems, Mixed-signal IPs and Advanced PHY technologies. * Experience with high-bandwidth and low-latency interconnect technologies. * Knowledge of packaging technologies and signal integrity considerations for high-speed systems. * Experience in AI, HPC, networking, connectivity, data-center, or memory infrastructure products. * Prior exposure to UALink, Ethernet switching, switch fabrics, or similar high-performance interconnect technologies is highly desirable. ## Description * Own end-to-end technical leadership and execution of complex SoC programs from architecture through silicon production. * Drive SoC planning, integration strategy, execution schedules, risk management, and tape-out readiness. * Lead cross-functional teams across digital design, verification, physical design, DFT, firmware, validation, packaging, and product engineering. * Define chip-level architecture, integration requirements, performance targets, and power/area objectives. * Drive technical decision-making and trade-off analysis across architecture, implementation, and product requirements. * Oversee subsystem and IP integration, ensuring successful deployment of complex multi-domain SoCs. * Partner with analog and SerDes teams to integrate high-speed interfaces and mixed-signal subsystems into the overall chip architecture. * Lead design reviews, execution reviews, silicon readiness assessments, and post-silicon debug activities. * Drive issue resolution across the development lifecycle and ensure successful first-pass silicon execution. * Mentor senior engineers and provide technical leadership across multiple engineering organizations. ## Related Videos - [The Gashlycrumb Tinies of AI Networking You Must Know (or Languish!)](https://www.wearedevelopers.com/videos/2067-the-gashlycrumb-tinies-of-ai-networking-you-must-know-or-languish) - [Designing UX for SRE Agents in High-Stakes Incidents](https://www.wearedevelopers.com/videos/100003-designing-ux-for-sre-agents-in-high-stakes-incidents) - [Playing Pong on a shoulder press machine](https://www.wearedevelopers.com/videos/100140-playing-pong-on-a-shoulder-press-machine) - [10M Data Records Lost, Underwater Computing, and Psychedelic Fish - Matthias Geniar](https://www.wearedevelopers.com/videos/1908-10m-data-records-lost-underwater-computing-and-psychedelic-fish-matthias-geniar) - [Building a hypercar from scratch](https://www.wearedevelopers.com/videos/607-building-a-hypercar-from-scratch) - [More efficient software for more efficient microchips](https://www.wearedevelopers.com/videos/1164-more-efficient-software-for-more-efficient-microchips) ## Related Articles - [What’s the Difference between a Junior, Mid, and Senior Developer?](https://www.wearedevelopers.com/magazine/238-what-s-the-difference-between-a-junior-mid-and-senior-developer) - [Is Software Engineering Over-Saturated?](https://www.wearedevelopers.com/magazine/418-is-software-engineering-over-saturated) - [Why Attend a Developer Event in 2026?](https://www.wearedevelopers.com/magazine/688-why-attend-a-developer-event-in-2026) - [How We Built a Worry-Free System That Runs for 10+ Years – And What We’d Do Again](https://www.wearedevelopers.com/magazine/751-how-we-built-a-worry-free-system-that-runs-for-10-years-and-what-we-d-do-again) - [How software is steering vehicle technology](https://www.wearedevelopers.com/magazine/515-how-software-is-steering-vehicle-technology) - [Highest Paying Tech Companies for Developers](https://www.wearedevelopers.com/magazine/220-highest-paying-tech-companies-for-developers)