> Markdown version of [/jobs/ext/2561166-senior-asic-package-design-automation-and-ai-engineer](https://www.wearedevelopers.com/jobs/ext/2561166-senior-asic-package-design-automation-and-ai-engineer). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Senior ASIC Package Design Automation and AI Engineer - **Company:** Advanced Micro Devices, Inc. - **Location:** Austin, TX, United States - **Experience:** Expert - **Salary:** $145,360.0 - **Contract:** Permanent contract - **Skills:** Artificial Intelligence, C++ (Programming Language), Computer Engineering, Electronic Design Automation, Python (Programming Language), Machine Learning, Tensorflow, Signal Integrity, Tcl (Programming Language), Linux Virtual Server, Application Specific Integrated Circuits, Pytorch, Information Technology, Data Analytics, Physical Design - **Published:** August 1, 2026 - **Apply:** https://diversityjobs.com/main/sendform/8/8/28176/1/17772841?backUrl=%2Fcareer%2F17772841%2FAi-Design-Automation-Engineer-Texas-Austin ## About the Role We are seeking a highly motivated and seasoned engineer to support the package design organization in the development and deployment of AI-driven automation workflows. This role will focus on improving the efficiency, quality, and scalability of complex package, bridge, and interposer design., * Translate complex design challenges into scalable automation solutions * Work effectively across Design, EDA, and AI/ML teams * Demonstrate strong problem-solving skills and ownership mindset * Operate with limited supervision, delivering high-quality results aligned to project goals * The candidate should be comfortable working in a multi-disciplinary environment and have strong communication skills to collaborate across internal and external stakeholders., * Experience in semiconductor packaging or SOC physical design automation * Strong working knowledge of EDA packaging tools such as Cadence APD / SiP, Siemens Xpedition and Synopsys 3DICC or equivalent * Expertise in scripting and automation using Python (preferred), Tcl, SKILL, or C++ * Experience applying AI/ML techniques to engineering or design workflows. Familiarity with frameworks such as PyTorch or TensorFlow . * Understanding of advanced packaging technologies such as 2.5D / 3D IC, Chiplets and heterogeneous integration, Bridge/interposer-based architectures * Familiarity with Design verification flows (DRC/LVS), Parasitic extraction and SI/PI fundamentals * Experience working with cross-functional teams (Design, SI/PI, Mechanical, EDA), * Bachelor's or higher degree in Electrical Engineering, Computer Engineering, Computer Science or related field. ## Description * Develop, deploy, and maintain automation frameworks and AI-assisted workflows for Package substrates, silicon interposers and bridge-based integration. * Apply AI/ML methodologies to enhance key design activities such as auto-routing and placement optimization, signal integrity and power delivery improvements, design rule compliance and verification. * Collaborate with package design team to identify high-impact automation opportunities, reduce manual design effort and cycle time, improve design robustness and quality. * Partner with EDA tools teams and vendors to implement automation features, enhance tool capabilities and workflows, support next-generation advanced packaging design enablement * Develop automation and tools to enable design flow integration, data extraction and analysis, closed-loop optimization with simulation teams * Support execution of design milestones and tape-outs, ensuring automation readiness and quality * Contribute to documentation, best practices, and reusable workflows for broader team adoption, AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD's "Responsible AI Policy" is available here. ## Related Videos - [The Software Engineer 2030: From Coder To AI Orchestrator? - Patrick Schnell](https://www.wearedevelopers.com/videos/1825-the-software-engineer-2030-from-coder-to-ai-orchestrator-patrick-schnell) - [PySpark - Combining Machine Learning & Big Data](https://www.wearedevelopers.com/videos/44-pyspark-combining-machine-learning-big-data) - [Machine learning in the browser with TensorFlowjs](https://www.wearedevelopers.com/videos/155-machine-learning-in-the-browser-with-tensorflowjs) - [Photonic Computing: Programming a New Class of AI Accelerators (incl. Live Coding)](https://www.wearedevelopers.com/videos/100196-photonic-computing-programming-a-new-class-of-ai-accelerators-incl-live-coding) - [Developing an AI.SDK](https://www.wearedevelopers.com/videos/198-developing-an-ai-sdk) - [From Model to Metal: An Open Source Stack for Accelerating Intelligence](https://www.wearedevelopers.com/videos/1636-from-model-to-metal-an-open-source-stack-for-accelerating-intelligence) ## Related Articles - [How to Become an AI Engineer](https://www.wearedevelopers.com/magazine/331-how-to-become-an-ai-engineer) - [What Industries Outside of AI Are Hiring The Most AI Experts?](https://www.wearedevelopers.com/magazine/98-what-industries-outside-of-ai-are-hiring-the-most-ai-experts) - [Stephan Gillich - Bringing AI Everywhere](https://www.wearedevelopers.com/magazine/489-stephan-gillich-bringing-ai-everywhere) - [Navigating the AI Shift](https://www.wearedevelopers.com/magazine/629-navigating-the-ai-shift) - [Dev Digest 201: Don't Stop Thinking, AI Slop vs. OSS Security, Rank Things](https://www.wearedevelopers.com/magazine/674-dev-digest-201-don-t-stop-thinking-ai-slop-vs-oss-security-rank-things) - [Dev Digest 166: Sycophancy, Zip bombs and AI Native Development](https://www.wearedevelopers.com/magazine/585-dev-digest-166-sycophancy-zip-bombs-and-ai-native-development)