> Markdown version of [/jobs/ext/2564923-senior-mixed-signal-embedded-hardware-engineer](https://www.wearedevelopers.com/jobs/ext/2564923-senior-mixed-signal-embedded-hardware-engineer). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Senior Mixed-Signal Embedded Hardware Engineer - **Company:** Medsense Health, Inc. - **Location:** United States (Remote available) - **Experience:** Expert - **Salary:** $166,400.0 - $270,400.0 - **Contract:** Permanent contract - **Skills:** Adobe Flash, Amazon S3, Software Debugging, Firmware, Hardware Design, Serial Communications, Signal Processing, Signal Integrity, PIC Microcontroller, Ripple (payment Protocol), Pcb Layout - **Published:** August 5, 2026 - **Apply:** https://www.indeed.com/viewjob?jk=61e76d495ee1fdd2 ## About the Role * Ideal candidate: a senior mixed-signal embedded hardware engineer with direct experience designing boards around Microchip dsPIC33 (or similar 16-bit MCUs). * Next-best candidate: a senior mixed-signal engineer who has designed boards around similar-class MCUs (PIC32, STM32, etc.) and can meticulously follow Microchip datasheets, reference schematics, and hardware-design guidance. Required Experience - must demonstrate previous designs involving at least TWO of the following: * Piezoelectric or other high-impedance sensors * High-speed, multi-channel analog acquisition * Low-noise amplifiers (LNAs) * Audio-frequency or ultrasonic signal processing * Precision timing or phase measurement * ADC channel matching * MCU-based DSP hardware integration * Four-layer (or more) mixed-signal PCB layout, * Do you have mixed signal experience? * Do you have DS PIC (Digital Signal processing chip) experience? * Do you have TDOA (time delay of arrival) experience? ## Description We are developing a high-precision acoustic/vibration Time Difference of Arrival (TDOA) positioning system. The core architecture has already been proven using a combination of development kits: * dsPIC Nano dev kit - acts as a precision digital TDOA timing simulator with correct, repeatable timing. * dsPIC33CK Curiosity Development Board - processes TDOA signals using high-speed, synchronized ADC acquisition. * Custom Analog Front End (AFE) PCB - buffers and filters real piezoelectric vibration sensor signals. These boards currently communicate with each other and a host over USB, which also supplies power and firmware/debug access. The Objective We are moving from this multi-board proof-of-concept to a single, consolidated, highly optimized integrated PCB assembly. We need a Senior Mixed-Signal Hardware Engineer to design a custom board that merges our proven MCU architecture and analog front-end into one high-performance prototype that: * Matches or exceeds the performance of the current dev-kit prototype. * Seamlessly supports both the digital TDOA simulator and the real analog vibration sensors. * Is ready for the next stage of product development and field testing. Hardware Architecture & Scope The resulting integrated assembly must provide: 1. ESP32-S3 Controller (DevKitC-1 equivalent): acts as the master TDOA controller and provides BLE services for result processing. USB-powered if the power budget allows, with USB also used for firmware updates and debugging. 2. Analog & Driver I/O: external connections for 3 high-impedance analog vibration sensors, plus a driver output for a calibration buzzer. 3. dsPIC33CK Integration: full support circuitry to operate, flash, and debug the dsPIC33CK DSP/MCU; serial communications with the ESP32-S3; and 3 synchronized high-speed ADCs for high-resolution TDOA processing. 4. Mixed-Signal Optimization: careful optimization of analog inputs, PCB layout, ground planes, and decoupling to preserve nanosecond-level timing accuracy and low-noise ADC performance. 5. Dual-Input Testing Capability: a clean, swappable input path that supports testing via either the digital dsPIC TDOA simulator (correct timing, logic-level output) or the three real analog vibration sensors. Key Responsibilities * Review & Reconstruct: review the current dev-kit/breadboard approach and reconstruct a complete, production-ready schematic, comparing it against the working AFE and dev kits. * Circuit Correction: optimize and correct power, reset, oscillator, programming, and high-speed ADC circuitry. * PCB Layout: create, update, and correct the 4-layer mixed-signal PCB layout with a strict focus on signal integrity, phase matching, and noise isolation. * Manufacturing: prepare manufacturing files (Gerbers, BOM, Pick & Place, assembly drawings) and resolve assembly-house queries. * Bring-Up & Debug: lead first-article board bring-up - power-on tests, supply rail and ripple/noise verification, flashing and debugging both MCUs, and validating communication, timing, and TDOA simulator results. * Iterate & Repair: diagnose first-round prototype issues, repair/rework boards where practical, and iterate the schematic/layout for the final version. ## Related Videos - [Playing Pong on a shoulder press machine](https://www.wearedevelopers.com/videos/100140-playing-pong-on-a-shoulder-press-machine) - [WeAreDevelopers LIVE - CSS is DOOMed](https://www.wearedevelopers.com/videos/1838-wearedevelopers-live-css-is-doomed) - [More efficient software for more efficient microchips](https://www.wearedevelopers.com/videos/1164-more-efficient-software-for-more-efficient-microchips) - [Agent Smith Gets Hardware: Autonomous IoT Hacking From Debug Port to Cloud API](https://www.wearedevelopers.com/videos/100258-agent-smith-gets-hardware-autonomous-iot-hacking-from-debug-port-to-cloud-api) - [From Bedside Beeps to Interoperable Bytes – Getting your medical devices ready to talk the IEEE 11073 language](https://www.wearedevelopers.com/videos/771-from-bedside-beeps-to-interoperable-bytes-getting-your-medical-devices-ready-to-talk-the-ieee-11073-language) - [Hate organising your photos? 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