> Markdown version of [/jobs/ext/259637-quantum-tsv-integration-engineer](https://www.wearedevelopers.com/jobs/ext/259637-quantum-tsv-integration-engineer). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Quantum TSV Integration Engineer - **Company:** Globalfoundries U.S. Inc. - **Location:** Malta, NY, United States - **Experience:** Expert - **Salary:** $98,000.0 - $176,000.0 - **Contract:** Permanent contract - **Skills:** Data Analysis, Signal Integrity, Network Switches - **Published:** May 20, 2026 - **Apply:** https://globalfoundries.wd1.myworkdayjobs.com/External/job/USA---New-York---Malta/Quantum-TSV-Integration-Engineer_JR-2602349 ## About the Role GlobalFoundries Fab8 is seeking a highly skilled and motivated R&D TSV engineer to become part of our Quantum Advanced Packaging team. The primary responsibility of this position is to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing., * Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. * MS degree with at least 8 years of prior related work experience. * Must have at least an overall 3.0 GPA and proven good academic standing. * Language Fluency - English (Written & Verbal). * Travel - Up to 20%., * Education - PhD education level preferred with at least 5 years of prior related work experience. * Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. * Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. * Strong written and verbal communication skills. * Strong planning & organizational skills. ## Description GlobalFoundries Fab8 is seeking a highly skilled and motivated R&D TSV engineer to become part of our Quantum Advanced Packaging team. The primary responsibility of this position is to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing., * Lead development of through-silicon via (TSV) processes for cryogenic and superconducting applications. * Define TSV architectures including: + Superconducting liners (e.g., Nb, Al-based) + Dielectric isolation schemes + Via geometries (diameter, depth, pitch) * Ensure TSV designs are optimized for: + Low-loss electrical/RF signal transport + Cryogenic thermal and mechanical stability * Own end-to-end TSV integration flows across: + Via etch, liner deposition, dielectric, and metallization + Wafer thinning, reveal, and backside processing + Integration into 2.5D/3D packaging stacks * Drive process integration planning to enable prototyping and qualification across programs. * Develop TSV solutions for superconducting interposers and 3D integration platforms * Support integration with: + Bump/interconnect layers + Redistribution routing layers (RDL) + Assembly and bonding flows * Ensure TSVs enable high-density vertical interconnects for quantum system scaling. * Enable prototype builds and development lots, ensuring smooth execution through fab and assembly flows. * Support transition from R&D to pilot to manufacturable flows. * Collaborate with device/test teams to ensure TSVs meet: + Cryogenic electrical performance requirements (DC + RF/microwave) + Low resistance and minimal loss for superconducting operation * Support characterization of: + Signal integrity (noise, crosstalk) + Thermal leakage across vias * Develop strategies to improve: + TSV yield and process robustness + Integration reliability under cryogenic conditions * Identify and analyze failure modes such as: + Liner defects / discontinuities + Delamination or cracking during thermal cycling + Void formation or via integrity issues * Lead root-cause analysis and corrective actions. * Work closely with materials teams to: + Select TSV liner and dielectric materials compatible with superconducting operation + Understand cryogenic behavior (CTE mismatch, stress, superconductivity limits) * Optimize interface integrity between via liner, dielectric, and substrate. * Define requirements for TSV-specific process tools: + Deep silicon etch (DRIE) + Conformal deposition (PVD/CVD/ALD) + Wafer thinning and reveal * Collaborate with equipment vendors and suppliers to develop new capabilities. * Support qualification of new tooling and materials. * Interface across: + Interconnect (bump / RDL) teams + Assembly and integration engineers + Device / qubit / system engineers * Ensure co-optimization of TSVs with full packaging stack. * Drive development of next-generation TSV scaling, including: + Smaller diameters and higher aspect ratios + Alignment with micro-bump pitch scaling * Contribute to cryogenic 3DHI roadmap and APPC capability build-out. * Evaluate novel via concepts (e.g., superconducting-lined, partially filled, or air-gap vias). * Generate: + TSV integration flows and specifications + Design rules and process documentation * Provide technical updates, reports, and data-driven insights. * Contribute to IP, publications, and conference outputs. Other Responsibilities * Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. * Take part in hiring of other Advanced Packaging team members in Singapore. * Mentor and guide new hires to assume their roles and responsibilities. * Other duties as assigned by manager. ## Related Videos - [The Quantum Computing Future](https://www.wearedevelopers.com/videos/1145-the-quantum-computing-future) - [Angular Signals: what's all the fuss about?](https://www.wearedevelopers.com/videos/684-angular-signals-what-s-all-the-fuss-about) - [Data Science in Retail](https://www.wearedevelopers.com/videos/586-data-science-in-retail) - [Alibaba Big Data and Machine Learning Technology](https://www.wearedevelopers.com/videos/37-alibaba-big-data-and-machine-learning-technology) - [Quantum Computing - The tiny and the big challenges](https://www.wearedevelopers.com/videos/934-quantum-computing-the-tiny-and-the-big-challenges) - [Robust AIGC Provenance with Invisible Watermarking](https://www.wearedevelopers.com/videos/100222-robust-aigc-provenance-with-invisible-watermarking) ## Related Articles - [Welcome to Switzerland](https://www.wearedevelopers.com/magazine/4-welcome-to-switzerland) - [Where to Find Entry-Level Software Engineering Jobs](https://www.wearedevelopers.com/magazine/397-where-to-find-entry-level-software-engineering-jobs) - [The Fastest-Growing Tech Sectors to Look Out for in 2025](https://www.wearedevelopers.com/magazine/373-the-fastest-growing-tech-sectors-to-look-out-for-in-2025) - [A Guide to Green Tech and Green IT Careers](https://www.wearedevelopers.com/magazine/374-a-guide-to-green-tech-and-green-it-careers) - [7 Cloud Computing Trends Coming in 2025 for Developers](https://www.wearedevelopers.com/magazine/412-7-cloud-computing-trends-coming-in-2025-for-developers) - [Where To Find Software Engineering Jobs](https://www.wearedevelopers.com/magazine/396-where-to-find-software-engineering-jobs)