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Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Principal Product Engineer, HPC Products - **Company:** ARM - **Location:** Austin, TX, United States - **Salary:** $249,900.0 - $338,100.0 - **Contract:** Permanent contract - **Skills:** Artificial Intelligence, Computer Engineering, Software Debugging, Microprocessors, Ethernet, Firmware, PCI Express, Scripting, Graphics Processing Unit (GPU), JMP (Statistical Software), Yield Optimization, Data Analytics - **Published:** September 3, 2026 - **Apply:** https://www.jofdav.com/jobs/59525563-principal-product-engineer-hpc-products ## About the Role * Bachelor's, Master's or Ph.D. in Electrical Engineering, Computer Engineering or a related technical discipline, with typically 12+ years of semiconductor industry experience. * Demonstrated experience bringing multiple complex CPU, GPU, accelerator or SoC products from pre-silicon through production/HVM, preferably on advanced process nodes. * Deep knowledge of silicon power, performance, voltage, frequency and temperature relationships; hands-on experience with PVTF, Vmin/Fmax, silicon variation and design-to-silicon correlation. * Strong understanding of semiconductor manufacturing flow, DFT/DFX, wafer sort, final test, SLT, qualification, binning, fusing, guardbanding and HVM yield optimization. * Working knowledge of HSIO productization, characterization and debug, with experience in one or more of PCIe/CXL, DDR/LPDDR/HBM, Ethernet/SerDes or die-to-die interfaces. * Ability to analyze large silicon datasets and drive structured root-cause decisions; experience with analytics/scripting tools such as JMP, Silicon.da/Optimal+ or equivalent is valuable. * Proven ability to lead complex cross-functional technical programs without direct organizational authority, with strong communication and problem-solving skills. "Nice To Have" Skills and Experience : * Direct experience with HPC, server-class CPUs, GPUs or AI/ML accelerators, particularly high-core-count/high-power products. * Experience with 2.5D/3DIC, chiplet architectures, advanced packaging, power delivery and thermal constraints. * Hands-on HSIO margining/system debug and experience establishing HSIO production screens and SLT coverage. * Experience with system-level performance, power, thermal and HSIO correlation, telemetry/on-die sensors, and automated product-health analytics. ## Description * Own end-to-end Product Engineering execution for complex HPC products from product definition through HVM, driving readiness, risk mitigation and technical closure across major milestones. * Partner with Architecture, Design, DFT/DFX, Validation, Software, Test and Product Management to define productization requirements, silicon observability, characterization plans and manufacturing readiness. * Lead first-silicon bring-up and PVTF characterization, including Vmin/Fmax, voltage-frequency behavior, leakage, dynamic power, thermal behavior, silicon distributions and production guardbands. * Drive performance and power correlation from pre-silicon models through silicon and system measurements; translate findings into product limits, binning, fusing and optimized operating points. * Own HSIO productization and characterization strategy for interfaces such as PCIe/CXL, DDR/LPDDR/HBM, Ethernet/SerDes and die-to-die interconnects, including margining, BER, jitter, eye margin, training/equalization and system-level debug. * Drive correlation across ATE, bench, SLT and representative platforms, including interactions among silicon, PHY, package, PCB, SI/PI, power delivery, thermal conditions and firmware/software. * Own manufacturing test and SLT strategy across wafer sort, final test and system-level environments, balancing coverage, outgoing quality, test time and cost. * Drive yield learning, product limits, qualification, reliability and failure analysis from first silicon through mature HVM; partner with foundry, OSAT and manufacturing/test suppliers on root cause and corrective actions. * Support advanced 2.5D/3D and chiplet-based productization and establish data-driven product-health metrics for yield, performance, power, HSIO margin, quality and manufacturing stability. * Provide senior cross-functional technical leadership, communicate complex issues to engineering and leadership teams, and mentor engineers on Product Engineering methodologies and best practices. ## About Arm Arm is the industry’s highest-performing and most power-efficient compute platform with unmatched scale that touches 100 percent of the connected global population. To meet the insatiable demand for compute, Arm is delivering advanced solutions that allow the world’s leading technology companies to unleash the unprecedented experiences and capabilities of AI. Together with the world’s largest computing ecosystem and 22 million software developers, we are building the future of AI on Arm. 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