> Markdown version of [/jobs/ext/2814491-dsp-embedded-firmware-engineer](https://www.wearedevelopers.com/jobs/ext/2814491-dsp-embedded-firmware-engineer). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # DSP & Embedded Firmware Engineer - **Company:** Rajant Corporation - **Location:** Malvern, PA, United States - **Experience:** Experienced - **Contract:** Permanent contract - **Skills:** Adobe Flash, Artificial Intelligence, Algorithm Design, ARM Architecture, Bluetooth Low Energy (Bluetooth), Bluetooth, C++ (Programming Language), Computer Engineering, Software Debugging, Embedded C, Embedded Software, Firmware, FreeRTOS, Joint Test Action (IEEE Standards), Python (Programming Language), MATLAB, Machine Learning, NumPy, Real-Time Operating Systems, SciPy, Signal Processing, Data Streaming, Wi-Fi Technology, Peripherals, Production Code, Bare Metal, Zigbee, Wearables - **Published:** September 10, 2026 - **Apply:** https://www.indeed.com/viewjob?jk=f85936d9027eea75 ## About the Role * B.S. or M.S. in Electrical Engineering, Computer Engineering, or a related field. * Approximately 3+ years of hands-on embedded C/C++ firmware development for low-power IoT devices, wearables, or similar embedded products. * Strong DSP fundamentals including FIR/IIR filters, FFTs, sampling, noise filtering, and fixed-point arithmetic tradeoffs. * Proficiency with Python (NumPy/SciPy) or MATLAB for sensor-data modeling, algorithm development, and verification. * Experience with ARM Cortex-M architecture, RTOS environments such as FreeRTOS or Zephyr, and bare-metal programming. * Practical experience with SPI, I2C, I2S, ADC, DMA, JTAG, oscilloscopes, logic analyzers, and hardware/firmware debugging. * Strong analytical, troubleshooting, documentation, and cross-functional communication skills., * Hands-on Bluetooth Low Energy (BLE) data streaming and profiles. * Experience with PPG, ECG, IMUs, or other wearable/biopotential sensors. * Experience with ultra-low-power MCUs such as Nordic nRF52/nRF53, STM32WB/L, or Ambiq Micro. * Exposure to embedded machine learning at the edge, including TinyML or CMSIS-NN., The ideal candidate combines strong embedded firmware skills with practical DSP knowledge and enjoys turning signal-processing concepts into efficient, reliable code on constrained hardware. You are hands-on in the lab, comfortable working across hardware and software, and motivated by low-power wearable and IoT product development. ## Description Rajant Health is seeking a DSP & Embedded Firmware Engineer to develop real-time signal processing algorithms and embedded firmware for next-generation wearable and IoT products. This hands-on role bridges low-power sensor data collection and efficient on-device processing, from algorithm prototyping in Python or MATLAB through implementation in C/C++ on resource-constrained MCUs and SoCs., * Design, simulate, implement low-power DSP and sensor-fusion algorithms for PPG, ECG, IMU/motion, environmental sensing, audio/voice trigger, or noise suppression. * Translate Python/MATLAB algorithm models into compact, real-time C/C++ firmware for ARM Cortex-M, Nordic nRF, STM32, Ambiq, or similar platforms. * Optimize execution, memory, and battery performance using fixed-point math, CMSIS-DSP, duty cycling, DMA, and efficient RAM/Flash utilization. * Configure, integrate, and debug sensor buses and peripherals including SPI, I2C, I2S, ADCs/AFEs, DMA, and related interfaces. * Integrate processed sensor data with low-power wireless links such as Bluetooth LE, Zigbee, or Wi-Fi in collaboration with system teams. * Use JTAG, oscilloscopes, logic analyzers, logs, and systematic testing to debug signal pipelines on prototype hardware and wearable flex-PCBs. * Document algorithms, firmware architecture, validation results, performance tradeoffs, and technical findings., * Build innovative connected healthcare and wearable technologies with real-world impact. * Work with engineers and technical teams across firmware, hardware, AI, cloud, and systems disciplines. * Solve challenging low-power sensing and edge-processing problems in a collaborative environment.