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Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Principal Early Supplier Involvement (ESI) Engineer - AI / Hyperscale Hardware - **Company:** Zt Group Int'l, Inc. - **Location:** Secaucus, NJ, United States - **Experience:** Experienced - **Salary:** $116,250.0 - $193,750.0 - **Contract:** Permanent contract - **Skills:** Computer-Aided Design, Agile Methodology, Artificial Intelligence, SolidWorks (CAD), Data Centers, Hardware Design, PCI Express, Rapid Prototyping Process, Siemens NX, Windchill, AI Infrastructure, Creo, Hardware Infrastructure - **Published:** September 24, 2026 - **Apply:** https://www.indeed.com/viewjob?jk=d402d0d17ecc1be1 ## About the Role * Education: Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or Manufacturing Engineering. * Experience: 4-8+ years in NPI engineering, hardware design, supplier technical development, or DFM for high-density compute, networking, or data center hardware. * Technical Expertise: + Hands-on experience with liquid cooling technologies (direct-to-chip, immersion, CDUs) or high-power/high-speed server architecture . + Advanced knowledge of GD&T, CAD software (Creo, SolidWorks, or Siemens NX), and tolerance stack-up analysis for server chasses and rack enclosures. + Direct experience conducting DFM reviews with Tier-1 EMS, PCB fabricators, and custom mechanical/thermal vendors. * Soft Skills: + Ability to communicate effectively across cross-functional boundaries-translating high-level AI system requirements into actionable supplier specifications. + Strong negotiation and technical decision-making skills in high-pressure, fast-paced environments., * Deep understanding of high-frequency materials (e.g., Megtron 6/7/8) and high-density interconnect (HDI) manufacturing. * Familiarity with Telcordia, OCP (Open Compute Project) standards, and NEBS compliance. Experience with automated should-cost tools (e.g., aPriori) and PLM systems (Agile, Windchill). * ## Description We are seeking a Principal Early Supplier Involvement (ESI) Engineer to drive hardware co-design, manufacturability, and supply chain readiness for our next-generation Data Center AI Infrastructure platform . In this role, you will act as the technical bridge between our System Architects, Mechanical/Thermal/Electrical Engineering teams, and strategic technology suppliers. You will engage with partners early in the concept phase (Phase 0/1) to de-risk high-density thermal architectures, complex high-speed PCBAs, and high-power delivery systems. Your goal is to ensure our AI computing systems achieve industry-leading time-to-market, uncompromised quality, and scalable cost-to-manufacture., * Advanced Thermal & Liquid Cooling DFM: Partner with liquid cooling suppliers (CDUs, cold plates, quick disconnects/QDCs, manifolds) to review fluid dynamics, materials compatibility, leak-mitigation designs, and high-volume manufacturability. * High-Speed PCBA & Custom Interconnects: Conduct early DFM/DFT reviews with EMS partners and substrate/PCB suppliers for complex AI accelerator boards, PCIe Gen 6/7, and optical interconnects (high layer-count PCBs, microvias, HDI). * Power Delivery Systems: Collaborate with power supply and busbar manufacturers to optimize ultra-high-density power distribution units (PDUs), power shelves, and voltage regulator modules (VRMs) for 100kW+ rack architectures. * Rack-Level Mechanical & Structural Integration: Work with chassis and rack-fabrication suppliers to ensure structural integrity, tolerance stack-up analysis (GD&T), and blind-mate blind-connector alignment., * Rapid NPI Prototyping: Oversee prototype builds with primary suppliers to accelerate engineering validation test (EVT) and design validation test (DVT) cycles. * Single/Sole-Source De-Risking: Identify single-point-of-failure components early in the CAD/schematic lifecycle and drive second-source qualifying pathways or modular redesigns. * Should-Cost & Process Yield Modeling: Analyze early component geometry, material selection, and process flows (e.g., skived vs. stamped cold plates, high-frequency laminates) to build accurate cost models and maximize production yields. ## Related Videos - [More efficient software for more efficient microchips](https://www.wearedevelopers.com/videos/1164-more-efficient-software-for-more-efficient-microchips) - [The Billion Dollar Machine: First Time Right.](https://www.wearedevelopers.com/videos/393-the-billion-dollar-machine-first-time-right) - [Shipping Faster with Less: Render on Cloud Hosting, AI Workloads, and the Future of DevOps](https://www.wearedevelopers.com/videos/1894-shipping-faster-with-less-render-on-cloud-hosting-ai-workloads-and-the-future-of-devops) ## Related Articles - [Best US AI Conferences for CTOs in 2026: Build vs. Buy, Vendor Evaluation, and Peer Intelligence](https://www.wearedevelopers.com/magazine/736-best-us-ai-conferences-for-ctos-in-2026-build-vs-buy-vendor-evaluation-and-peer-intelligence) - [How to Become an AI Engineer](https://www.wearedevelopers.com/magazine/331-how-to-become-an-ai-engineer) - [Stephan Gillich - Bringing AI Everywhere](https://www.wearedevelopers.com/magazine/489-stephan-gillich-bringing-ai-everywhere) - [How We Built a Worry-Free System That Runs for 10+ Years – And What We’d Do Again](https://www.wearedevelopers.com/magazine/751-how-we-built-a-worry-free-system-that-runs-for-10-years-and-what-we-d-do-again) - [6 Emerging Technologies We’ll Learn About in 2025](https://www.wearedevelopers.com/magazine/381-6-emerging-technologies-we-ll-learn-about-in-2025) - [Highest Paying Tech Companies for Developers](https://www.wearedevelopers.com/magazine/220-highest-paying-tech-companies-for-developers)