> Markdown version of [/jobs/ext/3289331-principal-sw-engineer](https://www.wearedevelopers.com/jobs/ext/3289331-principal-sw-engineer). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Principal SW Engineer - **Company:** Cadence, Inc. - **Location:** San Jose, CA, United States - **Experience:** Expert - **Salary:** $154,000.0 - $286,000.0 - **Contract:** Permanent contract - **Skills:** Artificial Intelligence, Perl (Programming Language), Python (Programming Language), Tcl (Programming Language), YAML, Scripting, Virtual Agents, Physical Design - **Published:** September 3, 2026 - **Apply:** https://www.themuse.com/jobs/cadence/sr-principal-sw-engineer-3dic-pr-aidriven-eda-automation ## About the Role * BS degree with 10+ years or MS degree and 5+ years of engineering work experience in the semiconductor industry. * Experience in physical implementation, place-and-route, and signoff tools. Familiar with Cadence digital flows and advanced packaging design with Allegro Package Designer. * Knowledge and experience in 3D-IC system planning, implementation, analysis, and signoff flows is a plus * Hands-on experience in scripting languages, such as TCL, Perl, YAML, and Python. * Good trouble-shooting and technical documentation skills. * A self-motivated, proactive leaner and team player, with excellent communication skills and a customer-oriented attitude. ## Description * Product Engineer for Integrity 3D-IC. * Developing interfaces and integrating various Cadence tools and engines into the Integrity 3D-IC platform. * Working closely with R&D group to develop, integrate and enhance 3D-IC solutions, including 3D-IC system planning, implementation, and analysis/verification, and Agentic AI applications. * Collaborating with the field teams in customer engagement and providing technical support and guidance. * Communicating and coordinating with multiple R&D groups and field teams to enable 3D-IC solutions to customers.