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# Hardware Engineer

- **Company:** GE Vernova
- **Location:** Rochester, NY, United States
- **Experience:** Experienced
- **Salary:** $80,000.0
- **Contract:** Permanent contract
- **Skills:** LTE (Telecommunication), Network Analysis, Ethernet, Hardware Design, USB, Wi-Fi Technology, Serial Peripheral Interface, 5G NR
- **Published:** September 13, 2026
- **Apply:** https://www.thejobnetwork.com/job/9ce739e4-6577-41e5-946f-e92f9e79cb97/hardware-engineer-pcb-circuit-design-industrialization-wireless-ecad-relocation-assistancesig

## About the Role

n As a Hardware Engineer for Critical Infrastructure Communications (CIC) at GE Grid Solutions, you will be responsible for designing industry-leading solutions for industrial grade wired and wireless communications products. CIC is seeking an experienced Electrical Engineer who is team-oriented and can thrive in the critical path of multiple projects. A successful candidate will have practical circuit-level design and troubleshooting experience in a laboratory environment. The ideal candidate should have working knowledge at the product level, as the candidate will be responsible for various aspects of the design throughout the product lifecycle including production. The successful candidate must also be capable of working collaboratively with peers in an international engineering organization to ensure design goals are met and critical trade-offs are identified. This role requires strong written and verbal communication skills to accurately convey complex solutions to audiences of
varying technical expertise on a cross-functional team spanning multiple sites.\n, Familiarity with emissions standards including FCC, IC, ETSI, Anatel, or ACMA
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Experience with communication interfaces and protocols (ex. Ethernet, USB, I2C, SPI, etc).
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Familiarity with safety standards including EN62368-1 and EN6095-1
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Proven knowledge of EMC and environmental standards required for CE Mark certification of telecommunication products
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Ability to multi-task, prioritize tasks, and quickly adapt in a fast-paced engineering environment
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Ability to solder/desolder surface mount and through hole components using a soldering station and heat gun
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Experience using signal generators, network analyzers, and spectrum analyzers
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Ability to work collaboratively with an international development team
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Familiarity with MCU, SoC, and modem Integration for 4G LTE, 5G, and WiFi technologies
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Demonstrated ability to work autonomously and collaborate with a team to resolve technical issues, Demonstrated ability to produce Hardware Design Specifications and other relevant design documentation