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# Staff Package Design Engineer

- **Company:** RENESAS ELECTRONICS AMERICA INC.
- **Location:** Tempe, AZ, United States
- **Experience:** Experienced
- **Contract:** Permanent contract
- **Skills:** Computer-Aided Design, Adobe InDesign, Artificial Intelligence, Computing Platforms, Databases, OrCAD, Package Development Process, Signal Integrity, Linux Virtual Server, Software Version Control
- **Published:** October 2, 2026
- **Apply:** https://dejobs.org/x/x/FEA5DEC0687D490AACB7E79860F6DC6B/job/

## About the Role

* 4+ years of hands-on experience in package CAD layout, substrate design, or advanced package development; 6+ years preferred.
 * Strong background in power module packaging, FCBGA, SiP, WLCSP, advanced substrate-based packages, and multi-die/chiplet-based package architectures.
 * High proficiency with industry-standard package design tools such as Cadence Allegro Package Designer / SiP Layout, Siemens Xpedition Substrate Integrator, or equivalent CAD platforms.
 * Proven experience applying advanced package design rules, substrate vendor constraints, OSAT assembly requirements, DFM/DFA principles, and manufacturing release standards.
 * Experience interfacing directly with Tier-1 OSATs, substrate suppliers, foundries, silicon design teams, and product engineering teams.
 * Working understanding of SI/PI fundamentals, high-speed routing, impedance control, power/ground distribution, and crosstalk mitigation.
 * Strong communication, presentation, and technical documentation skills, with demonstrated experience working effectively in global, cross-functional engineering environments., * Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.

## Description

In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. You will play a critical role in designing and delivering next-generation, high-performance semiconductor package solutions, including power modules, chiplet-based architectures, FCBGA, SiP, WLCSP, wire-bonded, QFP, and QFN packages supporting automotive SoCs, industrial IoT microcontrollers, and AI-enabled embedded computing platforms. This role requires strong technical depth in package layout execution, manufacturability, assembly process constraints, and cross-domain co-design with global silicon design, signal integrity/power integrity, thermal, reliability, and product engineering teams., * Execute package layout design and development for advanced package technologies, including power modules, FCBGA, SiP, WLCSP, and multi-chip modules.

 * Develop and maintain package CAD databases, ensuring accuracy and adherence to package design guidelines, DFM, and DFA requirements to support manufacturability, yield, and long-term reliability.
 * Manage the package design cycle, including schematic creation, netlist import, footprint assignment, layout implementation, verification, and generation of manufacturing release outputs such as Gerber/drill data, fabrication drawings, assembly drawings, bump maps, and related documentation.
 * Create and modify substrate and RDL layouts, bump maps, escape routing, stack-up structures, and power/ground distribution features.
 * Collaborate with SI/PI, thermal, reliability, DFT, silicon design, product engineering, and manufacturing teams to support package-level co-optimization and participate in design reviews.
 * Ensure package designs comply with applicable foundry, OSAT, substrate vendor, and manufacturing design rules, including DRC, LVS, connectivity, and netlist verification requirements.
 * Support Engineering Change Order cycles, design updates, revision control, and release documentation throughout the project lifecycle.