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# Lead Senior Member of Technical Staff, Advanced DRAM Overlay Engineer

- **Company:** Micron Technology, Inc.
- **Location:** Boise, ID, United States
- **Experience:** Expert
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Data Analysis, Dynamic Random-Access Memory
- **Published:** October 3, 2026
- **Apply:** https://www.dice.com/job-detail/9e47f044-bd37-4919-9874-491e309ecf9a

## About the Role

* Bachelor?s degree in engineering, physics, materials science, electrical engineering, chemical engineering, or related field
 * 10+ years of experience in overlay, lithography, metrology, process integration, wafer bonding, or related semiconductor technologies
 * Experience using data analysis and experimentation to solve complex technical problems
 * Understanding of overlay control, process capability, and semiconductor manufacturing fundamentals
 * Strong communication skills and ability to influence technical decisions across teams, * Master?s degree or PhD in engineering, physics, materials science, or related field
 * Experience with advanced DRAM, wafer bonding, or 3D integration technologies
 * Experience with overlay error budgeting, distortion characterization, or advanced metrology methods
 * Experience developing process control, automation, or optimization solutions
 * Experience Applying Artificial Intelligence or advanced analytics to semiconductor process development

## Description

As a Lead Senior Member of Technical Staff, Advanced DRAM Overlay Engineer, you will develop and deploy overlay solutions for future DRAM technologies. You will lead technical projects, influence technology direction, and mentor engineers while partnering with process teams and suppliers. This role offers deep technical ownership, opportunities to develop people, and direct impact on technology development and manufacturing readiness., * Lead development of overlay solutions for advanced DRAM and bonded device technologies

 * Develop overlay specifications, measurement strategies, and process control methodologies
 * Apply modeling, experimentation, and data analysis to improve overlay performance and capability
 * Collaborate with lithography, metrology, integration, bonding, and manufacturing teams to solve technical challenges
 * Drive supplier engagement and qualification of new overlay capabilities and technologies