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# IC Package Integration Lead

- **Company:** Apple Inc.
- **Location:** Austin, TX, United States
- **Experience:** Expert
- **Salary:** $262,500.0
- **Contract:** Permanent contract
- **Skills:** Systems Engineering, Signal Integrity
- **Published:** October 9, 2026
- **Apply:** https://www.themuse.com/jobs/apple/ic-package-integration-lead-fba1a7

## About the Role

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team., We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development, Managerial skills highly desired.

Good understanding of cross-functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA.

Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo-mechanical, reliability, and cost constraints.

Background and Knowledge of Cellular/Connectivity/PMU packaging highly desirable.

Excellent problem solving with strong physics and fundamentals.

Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.

Multi-functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost.

Ability to work independently and take on projects with minimum supervision.

Ability to lead and manage teams., BS and 20+ years of relevant industry experience.

## Description

Lead package co-design efforts with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical, thermal, reliability and fit requirements.