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# System Integration Test Lead / TPM

- **Company:** OSI Engineering
- **Location:** Cupertino, CA, United States
- **Experience:** Expert
- **Salary:** $124,800.0 - $191,360.0
- **Contract:** Internship / Graduate position
- **Skills:** Testing (Software), Data Analysis, Apple IOS, Apple Mac Systems, Systems Engineering, Automation of Tests, Communications Protocols, Computer Programming, Computer Engineering, Field-Programmable Gate Array (FPGA), Python (Programming Language), Parsing, Raspberry Pi, System Integration Testing, Strategies of Testing, Universal Asynchronous Receiver/Transmitter, Scripting, Serial Peripheral Interface, PIC Microcontroller, Build Process
- **Published:** October 15, 2026
- **Apply:** https://www.dice.com/job-detail/6dd88539-07fc-4e02-a0cb-ef6c6bbc96c1

## About the Role

* 2+ years of professional experience with a BS or MS in Electrical Engineering, Computer Engineering, Systems Engineering, Physics, or a closely related field

 * Hands on experience from academic projects, internships, or early industry work with PCB or embedded systems such as Raspberry Pi, microcontrollers, or FPGAs

 * NPI familiarity or clear readiness to lead NPI testing

 * Familiarity with test validation and statistical methods (Six Sigma concepts and Gage R&R) to assess test robustness

 * Programming or scripting experience for test automation or data analysis, Python or C preferred with ability to parse and summarize test logs

 * Strategic testing mindset with strong failure analysis and troubleshooting skills

 * Excellent communication, organizational, presentation and leadership skills with the ability to articulate complex issues clearly

 * Strong system and hardware fundamentals (Circuits, power electronics)

 * Strong analytical and problem-solving skills, with the ability to lead & thrive in a fast-paced environment

 * Experience with failure analysis and troubleshooting

 * Self-motivated and proactive with strong critical thinking

 * Proficient in macOS and iOS

Preferred Qualifications

 * Experience or interest in consumer electronics and accessory specific test concerns

 * Exposure to cross functional team collaboration and work with international OEM partners

 * Familiarity with hardware communication protocols such as I2C, SPI, UART

 * Familiarity with manufacturing test methodologies, including hardware and software test validation

 * Strong analytical and problem-solving skills, with the ability to thrive in a fast-paced environment

 * Program management exposure is a plus

 * Exposure to one or more of the following: Acoustics, Display, Touch, Imaging Sensors, Motion Sensors, PCBA, Power, or Battery

 * Experience with embedded system integration and development

## Description

* Oversee the preparation and execution of test readiness activities, including managing the transition from Surface-Mount Technology (SMT) to final assembly across all phases of product New Product Introduction (NPI) development

 * Plan, execute, and complete dry runs to ensure manufacturing test readiness for NPI builds, identifying potential issues before full production

 * Quickly identify, troubleshoot, and resolve any test-related issues that arise during the build process, ensuring minimal disruption and maintaining timelines

 * Create and implement strategic plans for addressing problems, ensuring timely and effective solutions

 * Work closely with engineering, manufacturing, and other cross-functional teams to ensure seamless communication and alignment on project goals and deliverables

 * Regularly track and report on the status of test progress, readiness, and outcomes, ensuring transparency and accountability throughout the project lifecycle

 * Continuously refine and improve test processes and methodologies to enhance quality, efficiency, and product maturity, ensuring compliance with industry standards and best practices

 * Ensure product test quality standard and manufacturing criteria are met