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Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Senior Director, Hardware - Mechanical & Thermal Eng -> Hyper Scale Systems (AI Networking) - **Company:** Cisco Systems, Inc. - **Location:** New York, NY, United States - **Experience:** Expert - **Salary:** $284,700.0 - **Contract:** Permanent contract - **Skills:** Artificial Intelligence, Cisco Hardwares, Data Transmissions, Hardware Design, IEEE Standards Association, Networking Hardware, Routing, Optimization Algorithms, Machine Learning Operations, Cisco - **Published:** October 21, 2026 - **Apply:** https://diversityjobs.com/career/18692803/Senior-Director-Hardware-Mechanical-Thermal-Eng-Hyper-Scale-Systems-Ai-Networking-California-San-Jose ## About the Role * Bachelor's degree in Mechanical Engineering or a related technical field or equivalent practical work experience. * 14+ years of professional engineering experience in mechanical and thermal engineering within microelectronics, networking, telecommunications, or hardware systems. * 5+ years of direct technical leadership experience managing multidisciplinary engineering teams (including managing engineers, engineering managers, or technical staff). * Experience in mechanical enclosure design, cooling system/thermal design, or tolerance analysis for electronic hardware systems., * Master's degree or Ph.D. in Mechanical Engineering or a related technical field or equivalent work experience in the hardware industry. * Direct experience building high-density hardware products for AI/ML and Hyperscale customers, track record employing AI/ML tools and optimization algorithms to accelerate and streamline mechanical and thermal design cycles. * Proven expertise with advanced cold plates, backing plates, liquid cooling architectures, optical devices, Co-Packaged Optics / Chip-Package-Optics (CPO), Chip-Package-Copper (CPC), Thermal Interface Materials (TIMs), and novel cooling solutions. * Deep experience with high-speed connectors, sheet metal fabrication, ruggedized enclosures, high-density cabling, ejector mechanisms, and large form-factor rack-level systems. * Proven ability to drive critical initiatives, process modernization, and new ways of thinking across globally distributed, multi-geographic, and multi-segment engineering teams. * Demonstrated capability to dive deep into critical technical partner concerns, conduct root-cause analysis, and structure team operating models to resolve high-stakes hardware issues swiftly. * Comprehensive understanding of evolving industry trends, IEEE standards, thermal test methodologies, and regulatory compliance standards across enterprise and service provider networking platforms. ## Description The high-impact System Thermal Engineering and Mechanical (STEAM) team within Networking Hardware Engineering (NHE) provides engineering leadership and foundational innovation across Cisco's core verticals, including Service Provider Routing, Enterprise Routing, and Switching. Our team is a critical partner across Cisco-driving innovation, advancing design reliability, optimizing engineering processes and infrastructure, and delivering scalable hardware solutions that power our most critical networking products. Cisco Hardware Engineers develop and work with next-generation technologies to build world-class hardware products, keeping user experience, IEEE standards, and industry guidelines at the forefront. We direct the hardware development function across research and technical design for electronic parts, circuitry, and mechanical/thermal systems, delivering an exceptional engineering experience that enables our teams to build market-leading platforms. Your Impact As the Senior Director of Mechanical and Thermal Engineering, you will lead a specialized, multi-disciplinary engineering organization dedicated to the research, design, and optimization of mechanical and thermal systems across the networking sector. You will shape next-generation package, board, and system technologies by driving simulation, experimental validation, and multi-functional optimization. Working closely with Silicon Design, Supply Chain, Electrical Design, Manufacturing, and Quality Assurance, your contributions will directly influence product reliability, performance, and manufacturability across active programs while establishing long-term technology roadmaps and industry leadership. * Manage, mentor, and develop a high-performing organization of engineering managers, senior engineers, and technicians, fostering a collaborative, transparent, and innovative culture. Structure the team to support varied engagement models and multi-functional demands. * Be responsible for the end-to-end development and execution of complex mechanical and thermal engineering projects, ensuring thorough alignment with company goals, schedules, and quality landmarks. * Lead the design and optimization of mechanical enclosures, sheet metal, cooling systems, tolerance analysis, material selection, and Design-for-Reliability (DFR) to improve performance and efficiency in networking applications. * Develop and scale engineering standards across multiple product lines, including employing AI/ML tools, algorithms, and computational optimization to accelerate mechanical and thermal design workflows. * Ensure all hardware designs strictly align with relevant IEEE standards, industry regulations, safety requirements, and standards, maintaining uncompromised quality and superior user experience. * Drive deep design reviews of mechanical enclosures, sheet metal fabrication, high-speed connector integration, tolerance analysis, and partner with technical collaborators on granular structural and thermal simulations. * Establish seamless data transfer and collaboration workflows between STEAM and partner teams-including Product Development, Silicon Design, Electrical Engineering, Supply Chain, Manufacturing, and QA-to drive innovation, efficiency, and design reliability. * Develop and execute strategic business and technology plans for the mechanical and thermal engineering department, authoring multi-year technology roadmaps for next-generation thermal, mechanical, and packaging solutions. * Synthesize complex technical updates, engineering tradeoffs, and critical needs into clear, actionable presentations for executive leadership, and engage directly with select customers when critical issues or architecture reviews arise.