> Markdown version of [/jobs/ext/3889652-memory-package-integration-architect](https://www.wearedevelopers.com/jobs/ext/3889652-memory-package-integration-architect). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md).

---

# Memory Package Integration Architect

- **Company:** Micron Technology, Inc.
- **Location:** San Jose, CA, United States
- **Experience:** Expert
- **Salary:** $143,000
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Electronic Design Automation, Systems Architecture, Large Language Models, Reliability of Systems, Ansys
- **Published:** October 23, 2026
- **Apply:** https://www.sanjosejobsite.com/job.asp?id=3466352021&tx=FP8178FFQ&pt=1&aff=0B19D771-A501-4A5E-8338-2A822B784D54&utm_source=Job%20Feed&utm_medium=textkernel&utm_campaign=DE&utm_term=0B19D771-A501-4A5E-8338-2A822B784D54

## About the Role

* Master's degree or equivalent practical experience in EE, CE, CS, or related field
 * 6+ years of Extensive hands-on experience in memory systems package design, signaling, IO design, PDN design
 * Deep understanding of memory timing, signaling, power, package process technology
 * working knowledge of EDA tools for design, analysis and simulation of electronic packaging, including but not limited to Cadence, Siemens and Ansys tools
 * Experience applying AI or LLMs for engineering efficiency, * Master's degree or PhD in a related technical field
 * Recognized technical leadership across multiple products
 * Experience in Signal and Power integrity analysis and mechanical and reliability analysis, thermal analysis
 * Expertise in memory systems architecture

## Description

* Define next-generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
 * Lead cross-stack co-optimization across silicon, package, board, and system with package centric solutions approach
 * Drive long-term memory technology packaging strategy and influence industry standards
 * Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and datacenter memory products
 * Serve as a technical interface to internal partners, customers, BUs, senior leaders.
 * Develop AI based multi-physics solutions for efficiency gains