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# R&D Hardware Engineer

- **Company:** Broadcom
- **Location:** San Jose, CA, United States
- **Experience:** Expert
- **Salary:** $101,000.0 - $162,000.0
- **Contract:** Permanent contract
- **Skills:** Hardware Design, Application Specific Integrated Circuits
- **Published:** October 26, 2026
- **Apply:** https://www.sanjosejobsite.com/job.asp?id=3467770508&tx=HT8478THD&pt=1&aff=0B19D771-A501-4A5E-8338-2A822B784D54&utm_source=Job%20Feed&utm_medium=textkernel&utm_campaign=DE&utm_term=0B19D771-A501-4A5E-8338-2A822B784D54

## About the Role

* Large high-powered SOCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 2.5D with 3D memories.
 * Precision Scopes, Analyzers, development & validation tools.
 * Understanding of Power and Thermal issues associated with PCBs with 1kW+ footprints
 * High-speed & High-density signaling with SerDes rates of 112G - 224G
 * Demonstrate lifecycle product ownership of complex products from conception to sustained high volume production.
 * Participating in a cross-functional team including Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability
 * Bachelor's degree in electrical engineering and 5+ years of related experience

## Description

As a Hardware Engineer, you will design, develop, and deliver Ultra High-performance electronic products. In addition, you may provide technical leadership to a small design team. We are looking for candidates who thrive in a fast-paced, start-up-like environment. We believe in small teams of highly experienced engineers. As such, we have a One Person One Board development culture, so you will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit/board design, development, and validation. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining.

You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, Joint development programs may require extensive interaction with partner engineering teams.