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# Solutions Engineer - AE

- **Company:** Cadence Design Systems, Inc.
- **Location:** United States
- **Experience:** Expert
- **Salary:** $162,400.0 - $301,600.0
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Application Notes, OrCAD, Process Driven Development, Signal Integrity, Software Deployment, Linux Virtual Server
- **Published:** October 26, 2026
- **Apply:** https://cadence.wd1.myworkdayjobs.com/External_Careers/job/No-Seat-Req-United-States/Solutions-Engineer---AE_R56940

## About the Role

* Bachelor's degree (Masters preferred) in Electrical or Electronics Engineering, or related discipline with
 * 10+ years of experience in semiconductor packaging, IC packaging, PCB, substrate, or interposer design.
 * Strong knowledge of:
 + Advanced package design methodologies
 + 2.5D and 3D-IC integration
 + Chiplet-based architectures
 + Package manufacturing and assembly processes
 + High-speed signal design
 + Power delivery networks
 * Experience performing package layout, routing, constraint management, and package signoff.
 * Solid understanding of package stackups, bump planning, escape routing, and substrate technologies.
 * Excellent customer-facing communication and presentation skills.
 * Ability to work independently while collaborating across global teams., * Experience with Cadence Integrity 3D-IC Platform.
 * Experience with Cadence Sigrity and Clarity 3D Solver.
 * Hands-on experience with Cadence Allegro X APD.
 * Knowledge of UCIe, HBM, AI accelerator packaging, and heterogeneous integration.
 * Experience supporting foundry and OSAT design flows.
 * Understanding of semiconductor assembly, reliability, and manufacturing processes.

Travel Expectations: Approximately 2% to 5% travel, depending on customer demand and business needs.

## Description

Cadence is seeking a highly motivated and experienced Solutions Application Engineer to support customers developing next-generation advanced packaging solutions, including 2.5D, 3D-IC, chiplet-based architectures, AI/HPC packages, and heterogeneous integration technologies.

The successful candidate will work directly with leading semiconductor companies, OSATs, foundries, and system companies to deploy and optimize Cadence Advanced Package 3D-IC associated design flows. This role combines technical expertise, customer engagement, solution development, and collaboration with R&D to drive customer success and product adoption.

Responsibilities

 * Provide technical leadership and application support for Cadence 3D-IC design solutions.
 * Assist customers with advanced package architecture, design implementation, and methodology development.
 * Develop and demonstrate complete packaging workflows for:
 + Organic substrates
 + Silicon interposers
 + Wafer Level Packaging
 + 2.5D and 3D-IC integration
 + Chiplet-based package architectures
 * Support customer evaluations, proof-of-concepts, benchmarks, and production deployments.
 * Deliver technical presentations, product demonstrations, workshops, and training sessions.
 * Collaborate with sales teams to identify opportunities and provide technical pre-sales support.
 * Work closely with R&D to communicate customer requirements, enhancement requests, and new technology needs.
 * Support design-signoff methodologies including:
 + DRC/LVS
 + Connectivity verification
 + Electrical rule checking
 + Thermal analysis
 + Signal Integrity (SI)
 + Power Integrity (PI)
 * Develop best practices, application notes, reference flows, and customer success methodologies.
 * Assist in defining future product direction for advanced packaging, 3D-IC, and chiplet technologies.