> Markdown version of [/jobs/ext/3935014-sr-principal-sw-engineer-3dic-p-r-ai-driven-eda-automation](https://www.wearedevelopers.com/jobs/ext/3935014-sr-principal-sw-engineer-3dic-p-r-ai-driven-eda-automation). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Sr. Principal SW Engineer, 3DIC P&R & AI-driven EDA Automation - **Company:** Cadence Design Systems, Inc. - **Location:** San Jose, CA, United States - **Experience:** Expert - **Salary:** $154,000.0 - $286,000.0 - **Contract:** Permanent contract - **Skills:** Artificial Intelligence, Perl (Programming Language), Python (Programming Language), Tcl (Programming Language), YAML, Scripting, Agentic-AI, Physical Design - **Published:** October 26, 2026 - **Apply:** https://www.sanjosejobsite.com/job.asp?id=3466804568&tx=JT10092UYD&pt=1&aff=0B19D771-A501-4A5E-8338-2A822B784D54&utm_source=Job%20Feed&utm_medium=textkernel&utm_campaign=DE&utm_term=0B19D771-A501-4A5E-8338-2A822B784D54 ## About the Role * BS degree with 10+ years or MS degree and 5+ years of engineering work experience in the semiconductor industry. * Experience in physical implementation, place-and-route, and signoff tools. Familiar with Cadence digital flows and advanced packaging design with Allegro Package Designer. * Knowledge and experience in 3D-IC system planning, implementation, analysis, and signoff flows is a plus * Hands-on experience in scripting languages, such as TCL, Perl, YAML, and Python. * Good trouble-shooting and technical documentation skills. * A self-motivated, proactive leaner and team player, with excellent communication skills and a customer-oriented attitude. ## Description * Product Engineer for Integrity 3D-IC. * Developing interfaces and integrating various Cadence tools and engines into the Integrity 3D-IC platform. * Working closely with R&D group to develop, integrate and enhance 3D-IC solutions, including 3D-IC system planning, implementation, and analysis/verification, and Agentic AI applications. * Collaborating with the field teams in customer engagement and providing technical support and guidance. * Communicating and coordinating with multiple R&D groups and field teams to enable 3D-IC solutions to customers.