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# MTS Packaging Integration Engineer

- **Company:** Globalfoundries U.S. Inc.
- **Location:** Essex, VT, United States
- **Experience:** Experienced
- **Salary:** $94,300.0 - $175,100.0
- **Contract:** Permanent contract
- **Skills:** Data Analysis, Failure Mode Effects Analysis
- **Published:** October 27, 2026
- **Apply:** https://www.jofdav.com/jobs/60289894-mts-packaging-integration-engineer

## About the Role

A successful candidate would possess assembly expertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnect and packaging solutions with present state-of-the-art electrical interconnect solutions. It is expected that options for optical fiber attach will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding., * MS, or PhD + 4 or more years of experience

 * Extensive experience with failure analysis, design of experiments, & packaging process integration.
 * Experience in bringing packaged products from development into production.
 * Strong written and spoken English communication skills

Preferred Qualifications:

 * Materials science, thermal, mechanical, simulation background.
 * Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.
 * Expert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
 * Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.

## Description

* Defines process integration specifications for assembly flow of co-packaged optics modules driving toward cost, yield, and reliability targets.
 * Establishment of manufacturing driven design rules.
 * Ensures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concepts.
 * Driving SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
 * Provides tools and complex analysis of quality issues and associated financial implications
 * Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.
 * Ensures standardization of site-based quality processes are executed appropriately
 * Drives discipline and qualification robustness through a consistent global qualification process
 * Typically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:
 + Perform project management and data analysis
 + Identify and resolve process integration issues and related problems
 + Develop custom or derivative processes to meet customer needs
 + Support new designs with module characterization and design rule development
 + Work with cross function teams to resolve technical & yield concerns
 + Develop and improve test structures that enable fast and rigorous characterization of process
 + Drive CIP (Continuous improvement plans) to deliver organizational goals
 + Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.