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# 3D Heterogeneous Integration Engineer

- **Company:** Globalfoundries U.S. Inc.
- **Location:** Malta, NY, United States
- **Experience:** Experienced
- **Salary:** $98,000.0 - $176,000.0
- **Contract:** Permanent contract
- **Skills:** Adobe InDesign, Data Analysis, Package Development Process
- **Published:** October 27, 2026
- **Apply:** https://www.jofdav.com/jobs/60289896-3d-heterogeneous-integration-engineer

## About the Role

* Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
 * MS degree with at least 5 years of prior related work experience.
 * In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
 * Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
 * Must have at least an overall 3.0 GPA and proven good academic standing.
 * Language Fluency - English (Written & Verbal).
 * Travel - Up to 10%., * Education - PhD education level preferred with at least 3 years of prior related work experience.
 * Demonstrated prior leadership experience internally or with an OSAT eco-system.
 * Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
 * Strong written and verbal communication skills.
 * Strong planning and organizational skills.

## Description

* Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.).
 * Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs.
 * Collaborate joint development projects (JDP) with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.
 * Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.
 * Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources.
 * Drive data analysis, interpretation of results, and understanding of failure modes.
 * Identify and resolve process integration issues and related challenges.
 * Generate IP related to novel wafer integration and packaging technology.

Other Responsibilities:

 * Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
 * Participate in hiring activities.
 * Mentor and guide new hires to assume their roles and responsibilities.
 * Other duties as assigned by manager.