> Markdown version of [/jobs/ext/3959020-principal-digital-design-engineer](https://www.wearedevelopers.com/jobs/ext/3959020-principal-digital-design-engineer). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Principal Digital Design Engineer - **Company:** Renesas Electronics America Inc. - **Location:** San Jose, CA, United States - **Experience:** Expert - **Salary:** $190,000.0 - $240,000.0 - **Contract:** Permanent contract - **Skills:** Artificial Intelligence, Software Debugging, Logic Synthesis of Circuits, Dynamic Random-Access Memory, Flash Memory, Universal Asynchronous Receiver/Transmitter - **Published:** October 27, 2026 - **Apply:** https://www.thejobnetwork.com/job/615cabc0-46aa-4795-af57-7d6b57f660e2/principal-digital-design-engineer ## About the Role * Education: MSEE or PH.D. in Electrical Engineering with 8+ years of relevant industry experience, or BSEE in Electrical Engineering with 12+ years of relevant industry experience * Proven experience in SOC architecture, AHB/APB/AXI, bus matrix and interface protocols - USB, I2C/I3C, SPI, UART; packet-oriented protocols. * Good knowledge of embedded memories - SRAM, OTP, MTP and EE/Flash memory * Good knowledge of design flow. Hands on in chip architecture definition, Partition, assignment, RTL coding, simulation, synthesis, DFT and timing check * Strong Communication and Teamwork Skills * Highly Motivated and Creative Individuals * AI Savvy and leveraging AI in daily work * Bilingual and Mandarin fluency would be a plus * DDR DRAM and Flash memory knowledge would be a plus * Mixed signal knowledge and mixed-signal chip development experience is highly preferred. * Project management skills are highly preferred ## Description This is a Principal Digital Engineer position for a qualified individual to work in Renesas' Analog and Mixed Signal Business Group. The primary role is to architect, design and implement the digital and mixed signal IC. The candidate will work together with the team in the other sites of United State and the team in China and contribute to all aspects of development from product conception to production release. The Candidate should have experience in architecting and leading the development, with a proven track record of delivering high-quality silicon on time and within cost targets. The candidate will also be responsible for design documentation, silicon evaluation, circuit debugging, production test development support, and customer and applications support. He/she will also be involved in the specification of technology requirements for future products.