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# Senior Staff Engineer Module Package Development

- **Company:** Infineon Technologies AG
- **Location:** Neubiberg, Germany
- **Experience:** Expert
- **Contract:** Permanent contract
- **Skills:** AutoCAD, Artificial Intelligence, Minitab, Package Development Process, Reliability Engineering, JMP (Statistical Software), Backend
- **Published:** October 21, 2026
- **Apply:** https://www.indeed.com/viewjob?jk=63f594f9dcc82819

## About the Role

* Bachelor's degree in Engineering (e.g., Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Applied Physics) with ~7+ years of relevant experience in assembly technologies.
 * Strong hands-on knowledge of Back-End processes, materials, and interdependencies (including laminate design, materials, and manufacturing processes).
 * Working knowledge of SMT and PCB/module-related technologies.
 * Expertise in semiconductor packaging, assembly, and test.
 * Working knowledge on flip/chip process, package/strip grinding, molding
 * Experience with failure analysis and reliability engineering.
 * Strong analytical, statistical ( JMP, Minitab), and structured problem-solving skills.
 * AutoCAD and 3D drafting skills preferred.
 * Excellent communication and presentation skills, must be able to communicate effectively English ( Mandarin is a plus), both verbally and in writing.

## Description

* Develop and define package concepts for AI power-supply products, with an emphasis on high-performance computing (HPC) modules.
 * Validate proposed package concepts through simulation and hardware demonstrators, working closely with Back-End development, product development, and system architects.
 * Coordinate and align new package ideas with Back-End development teams (internal and OSAT partners) and launch required assembly projects.
 * Track and support package development projects through to final product release.
 * Identify emerging development needs and translate them into additions/updates to the package roadmap.
 * Serve as the technical point of contact for customer questions related to packaging.
 * Stay current on packaging solutions by continuously monitoring market trends and conducting competitor benchmarking.
 * Spot and assess business opportunities created by new technologies and packaging concepts.
 * Lead the technical definition for major/new package projects (e.g., BOM, package design, assembly technology selection, PRP reviews, project classification), including risk and impact assessment.
 * Define package characteristics that satisfy electrical, thermal, mechanical, and reliability requirements.
 * Act as a key interface to partners and technical consultants on package definition, particularly for Back-End assembly technology expertise.
 * Support pre-development and project definition activities and remain the packaging design expert throughout the full project lifecycle.