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Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Test Engineer - **Company:** HII Mission Technologies - **Location:** Adelphi, MD, United States - **Experience:** Experienced - **Salary:** $79,869.0 - $180,000.0 - **Contract:** Temporary contract - **Skills:** Microsoft Word, Microsoft Excel, 3D Printing, Computer-Aided Design, Altium Designer, Data Analysis, Network Analysis, Comsol Multiphysics, SolidWorks (CAD), Microsoft Office, Microsoft PowerPoint, Microsoft SharePoint, Signal Processing, Office365, Ansys - **Published:** October 4, 2026 - **Apply:** https://www.clearancejobs.com/jobs/9219808/test-engineer ## About the Role * 2-9 years relevant experience with Bachelors in related field; 0-7 years relevant experience with Masters in related field; 0-4 years relevant experience with PhD or Juris Doctorate in related field; or High School Diploma or equivalent and 6-13 years relevant experience. * Test Engineer 2 - 2 years relevant experience with Bachelors in related field; 0 years experience with Masters in related field; or High School Diploma or equivalent and 6 years relevant experience. * Test Engineer 3 - 5 years relevant experience with Bachelors in related field; 3 years relevant experience with Masters in related field; 0 years experience with PhD or Juris Doctorate in related field; or High School Diploma or equivalent and 9 years relevant experience. * Test Engineer 4 - 9 years relevant experience with Bachelors in related field; 7 years relevant experience with Masters in related field; 4 years relevant experience with PhD or Juris Doctorate in related field; or High School Diploma or equivalent and 13 years relevant experience. * Demonstrated proficiency in electronics packaging and test, including: * + Soldering (SMT & through-hole), cable/harness assembly, and PCB rework under microscope. + Reading/creating schematics, assembly drawings, BOMs, and work instructions. + Setting up and operating lab instrumentation (DMMs, oscilloscopes, spectrum/network analyzers, power supplies, temperature chambers, probe stations). + Executing frequency-domain signal analysis for diagnostics and performance verification. + Hands-on mechanical aptitude integrating electronics into housings/fixtures. * Strong Microsoft Office 365 (Excel, Word, PowerPoint, SharePoint/OneDrive) for data, documentation, and collaboration. * Clearance: Ability to obtain and maintain a SECRET security clearance. Preferred Requirements * Packaging & Materials * + Experience with IPC J-STD-001 and IPC-A-610 workmanship standards. + Deep familiarity with adhesives/underfills/encapsulants (cure kinetics, rheology, Tg, modulus, moisture absorption) and solder alloys/sintered joints (wetting, intermetallics, voids, thermal cycling behavior). + Wire bonding (ball/wedge) process experience; flip-chip underfill selection & dispensing. + Experience with high-dielectric-strength encapsulants and partial-discharge-resistant insulation materials to suppress electric field concentrations and prevent breakdown under extreme high-voltage transient regimes. + Experience in developing multi-die electronic power modules (SiC or GaN) utilizing kilovolt(kV)-rated MOSFETs, IGBTs, and diodes. * CAD/Simulation * + Proficiency with SolidWorks (assemblies, drawings, GD&T) and ANSYS Workbench/COMSOL Multiphysics for thermal/mechanical/electrical/vibration analysis. + Experience with PCB CAD (e.g., Altium) for stack-up, keep-outs, and packaging-aware layouts. * Manufacturing & DFM * + Experience delivering hardware via CNC, sheet metal, injection molding, and 3D printing (FDM/SLA/SLS), including DFM, tolerance stack-up, and supplier engagement. + Knowledge of fixture design and metrology for repeatable assembly and measurement. * Reliability & Test * + Environmental testing (e.g., THB, temp cycling, vibration/modal, high-voltage partial discharge), and data analysis for reliability predictions. + Non-destructive evaluation (X-ray, C-SAM) and destructive FA (cross-sectioning, polish, microscopy). + Experience authoring test plans, qualification protocols, and FA/RCA reports. * Wafer-Level / Cleanroom * + Exposure to wafer-level processes and cleanroom tools (e.g., lithography, deposition, etch, wire bonders, die attach)-useful for die-to-interposer packaging workflows. * Field Test Experience * + Prior support of laboratory and field test events for R&D programs, with a focus on ruggedization and rapid iteration. Physical Requirements * Work in office, industrial, and laboratory environments; comfortable with ladders, confined spaces, and temperature variances. * Fine motor skills for microscope-level assembly (e.g., wire bonding, micro-soldering). * Ability to lift lab equipment/fixtures and stand at benches for extended periods. ## Description We are seeking a hands-on Electronics Packaging, Reliability & Test Engineer to lead prototype hardware build, reliability test, and failure analysis in support of the U.S. Army Research Laboratory (ARL) in Adelphi, MD. This role blends electronics packaging, thermal/electrical/mechanical analysis, bench-level testing, and manufacturing/DFM to deliver rugged, field-ready systems., + Assemble and solder complex mixed-signal boards (analog/digital/RF), including SMT and through-hole. + Integrate electronics into electromechanical housings, ensuring fit, thermal paths, strain relief, shielding, sealing, and serviceability. + Implement packaging best practices: die attach, wire bonding, underfill/encapsulation/staking, conformal coating, and strain mitigation for connectors and harnesses. * Materials & Process Engineering * + Select and qualify adhesives (air, bake, UV cure), underfills, potting compounds, coatings, and solder/sintered metallurgical systems based on CTE match, Tg, modulus, outgassing, moisture ingress, electrical performance, and service environment. + Define process recipes (surface prep, cure schedules, bake profiles, reflow profiles, bond parameters) and create work instructions. * Mechanical CAD & Simulation * + Create mechanical designs and engineering drawings (GD&T) in SolidWorks for custom enclosures, brackets, thermal interfaces, and fixtures. + Conduct FEA/Multiphysics modeling in ANSYS Workbench or COMSOL for thermal stress, mechanical stress, electrical stress, and vibration/modal analysis; propose mitigations (stiffeners, damping, isolation, fasteners, fillets/chamfers, materials). * Manufacturing & DFM * + Develop DFM guidelines and release designs for CNC machining, sheet metal, injection molding, and 3D printing; coordinate with machine shops/vendors and review NCRs/FAI results. + Build/iterate test fixtures and jigs for repeatable assembly and measurement. * Benchtop & Environmental Testing * + Set up and operate probe stations, heated stages, temperature-humidity-bias (THB) chambers, and temperature cycling (e.g., -40°C to +85°C) with relevant dwell/ramp profiles. + Execute frequency-domain signal analysis (FFT, spectrum analysis) of mixed-signal/RF chains using oscilloscopes, spectrum/network analyzers, and data acquisition. + Develop test plans, procedures, and acceptance criteria; capture repeatable datasets and traceability. * Failure Analysis & Inspection * + Perform destructive analyses: cross-sectioning, grinding, polishing, optical inspection-document defects (voiding, cracks, delamination, intermetallics, corrosion). + Conduct non-destructive analyses: X-ray and Scanning Acoustic Microscopy (SAM/C-SAM) for voids, bond quality, underfill coverage, and delamination. + Drive root cause analysis (RCA) and corrective actions; maintain FA reports and lessons learned. * Documentation & Lab Ops * + Author and maintain assembly procedures, test protocols, drawings, BOMs, RCA/FA reports, and engineering memos. + Manage lab equipment inventories, calibration schedules, and component stock (Excel/O365); ensure ESD, safety, and quality compliance.