> Markdown version of [/jobs/ext/4163468-engineer-design](https://www.wearedevelopers.com/jobs/ext/4163468-engineer-design). Every page supports `.md` or `Accept: text/markdown`. Links point to the HTML versions so they work for humans too. Agent guide: [/agents.md](https://www.wearedevelopers.com/agents.md). --- # Engineer, Design - **Company:** Amkor Technology - **Location:** Tempe, AZ, United States - **Contract:** Permanent contract - **Skills:** Computer-Aided Design, Software Tools, CAM350, Signal Integrity, Hfss - **Published:** October 12, 2026 - **Apply:** https://career8.successfactors.com/career?career_ns=job_listing&company=amkor&navBarLevel=JOB_SEARCH&career_job_req_id=29100 ## About the Role * Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related engineering discipline. * Experience using CAD or similar engineering software to create and maintain technical drawings. * Strong verbal and written communication skills. * Ability to manage multiple tasks and complete assignments effectively with minimal supervision. * Self-motivated, detail-oriented, and able to work collaboratively in a team environment. * Demonstrated ability to meet project deadlines and manage priorities in a fast-paced setting. Preferred Qualifications: * Experience in semiconductor packaging design. * Experience using package design and simulation tools such as Cadence APD, Cadence Sigrity, Siemens Expedition, Ansys HFSS, and CAM350. * PCB design experience. * Working knowledge of Geometric Dimensioning and Tolerancing (GD&T) practices. * Signal Integrity (SI) and Power Integrity (PI) analysis experience. ## Description Amkor Technology is seeking an IC Package Design Engineer for its Tempe, Arizona location. This role is responsible for developing high-quality IC package designs, creating detailed engineering drawings, and supporting multiple design-related activities within the Design Center. The engineer collaborates with internal teams and customers to deliver package solutions that meet thermal, mechanical, electrical, and manufacturing requirements., * Design laminate (BGA) and wafer-level semiconductor packages, including determination of design rules, optimization, verification, and package selection based on thermal, mechanical, and electrical requirements. * Create accurate and detailed engineering drawings with minimal supervision. * Analyze and resolve design challenges and customer-related technical issues using sound engineering principles. * Identify opportunities to improve design methodologies, processes, and technologies. * Exercise sound judgment when making design-related decisions and recommendations. * Build and maintain effective partnerships with customers and cross-functional teams to support quality and productivity objectives. * Collaborate with Amkor Product Group and Sales teams to ensure customer requirements are understood and achieved. * Interface with internal and external customers to support design reviews, technical discussions, and project execution. * Prepare technical documentation and maintain accurate engineering records. * Demonstrate a continuous learning mindset and contribute positively to team development and knowledge sharing. * Perform other duties as assigned.