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# 3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate)

- **Company:** GF U.S. Inc.
- **Location:** Malta, NY, United States
- **Experience:** Starter
- **Salary:** $65,400.0 - $145,800.0
- **Contract:** Internship / Graduate position
- **Skills:** Adobe InDesign, Linux Virtual Server, Integration Frameworks
- **Published:** October 8, 2026
- **Apply:** https://globalfoundries.wd1.myworkdayjobs.com/External/job/USA---New-York---Malta/XMLNAME-3D-Heterogeneous-Integration-Design-Enablement-Engineer--2025-New-College-Graduate-_JR-2501678

## About the Role

* Education - PhD with completed defended thesis or Master's in Electrical Engineering and Materials Science or related field from an accredited degree program.

 * Must have at least an overall 3.0 GPA and proven good academic standing.

 * Language Fluency - English (Written & Verbal).

 * Travel - Up to 10%.

Preferred Qualifications:

 * Prior-related internship or co-op experience in design or EDA/design enablement

 * Fundamental knowledge of semiconductor packaging process modules and integration.

 * Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.

 * Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.

 * Strong written and verbal communication skills.

 * Strong planning & organizational skills.

## Description

GlobalFoundries Fab8 is seeking a motivated R&D design enablement engineer to become part of our state-of-the-art 300mm fabrication facility in Malta, New York. This role will entail 3D heterogeneous integration (3DHI) design enablement to enable our next-generation advanced packaging R&D efforts, which include wafer-to-wafer bonding, die-to-wafer bonding, TSV/TOV and interposer development.

Essential Responsibilities:

 * Publish Design Manual (DM) specifications based on failure modes identified for packaging required by the product lines in partnership with the unit process and R&D engineers.

 * DM is a collection of all technology restrictions (geometry rules, electrical rules, etc.) that must be followed for an integrated circuit (IC) design to be manufacturable.

 * Advanced packaging liaison to the DM and PDK (Process Design Kit) teams to translate packaging requirements to a device enablement specification covering: design rules, library device(TSV) layouts, layout vs schematic(LVS) requirements, device model terminals.

 * Develop expertise in drafting test vehicle content specifications and the associated tapeout process (including mask reviews).

 * Develop expertise in drafting test specifications for test vehicle content (macros); engage with the test teams (inline and lab) to ensure alignment on test requests.

 * Collaborate with vendors and OSATs (Outsourced Assembly and Test) on design (test vehicles, masks).

 * Facilitate advanced packaging design interactions between the product lines/fab teams and customers.

 * Work and collaborate with other teams regarding different assignments as needed.

Other Responsibilities:

 * Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

 * Other duties as assigned by manager.