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# MTS - Optical Interconnect Design Architect

- **Company:** Micron Technology, Inc.
- **Location:** Richardson, TX, United States
- **Experience:** Expert
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Computer Engineering, Wavelength-Division Multiplexing, Network Switches, Low Latency
- **Published:** October 14, 2026
- **Apply:** https://www.indeed.com/viewjob?jk=d773154c173b38c8

## About the Role

* Demonstrated experience in one or more of the following: Optical Interconnect Architecture, Silicon Photonics, High-Speed I/O Systems, Optical Communication Systems
 * Strong understanding of: Optical communication fundamentals, Wavelength Division Multiplexing (WDM/DWDM), Optical link budgeting, Photonic Integrated Circuit design
 * Experience performing architecture-level tradeoff analysis involving performance, power, thermal, cost, and scalability metrics.
 * Apply AI assisted analysis to evaluate architectural tradeoffs and technology benchmarking.
 * Working knowledge of advanced semiconductor packaging technologies including chiplets, hybrid bonding, 2.5D/3D integration, and heterogeneous integration.
 * Proven ability to drive technical initiatives across multiple engineering disciplines., * PhD in Electrical Engineering, Optics, Photonics, Physics, Computer Engineering, or a related technical discipline with 5+ years of industry experience; or
 * Master's degree with 8+ years of relevant industry experience.

## Description

* Drive architecture exploration and technology pathfinding that bridges current high-speed electrical I/O and die-to-die interconnect solutions with future optical interface technologies for AI, HBM, and chiplet-based systems.
 * Define optical interconnect architectures for next-generation memory and AI computing systems.
 * Lead architectural tradeoff studies across electrical and optical interconnect technologies, evaluating bandwidth density, latency, power efficiency, thermal performance, reliability, and cost.
 * Develop optical I/O architectures incorporating Photonic Integrated Circuits (PICs), modulators, detectors, Waveguide technologies, packaging and fiber interfaces, Silicon photonics integration
 * Assess emerging technologies including Optical Interposers, Co-Packaged Optics (CPO), and Near-Package Optics (NPO).
 * Drive proof-of-concept demonstrations and technology pathfinding activities for future HBM and die-to-die optical interconnect solutions.