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# Director, Custom HBM Design and Architecture

- **Company:** Micron Technology, Inc.
- **Location:** Folsom, CA, United States
- **Salary:** $199,000.0
- **Contract:** Permanent contract
- **Skills:** Artificial Intelligence, Software Debugging, Dynamic Random-Access Memory, Electronic Design Automation, Firmware, Python (Programming Language), Machine Learning, Systems Architecture, System on a Chip, SystemVerilog, Systems Integration, Tcl (Programming Language), Scripting, PIC Microcontroller, Large Language Models, Machine Learning Operations, Physical Design
- **Published:** October 8, 2026
- **Apply:** https://dejobs.org/x/x/86846A2506AC4F289E32C24072161FEC/job/

## About the Role

* Proven experience leading large-scale SoC design teams delivering complex SoCs to advanced process nodes (e.g., TSMC).
 * Deep expertise in RTL design, SoC integration, and full RTL-to-GDS flows, including synthesis, timing, and signoff considerations.
 * Strong experience integrating complex IP subsystems (controllers, NOC, microcontrollers, PHY-adjacent logic, RAS, MBIST, interfaces).
 * Solid understanding of SoC architecture, clocking, reset, power management, and system-level design trade-offs.
 * Experience with pre-silicon validation, hardware emulation, and post-silicon debug methodologies.
 * Familiarity with EDA tools and scripting languages (e.g., SystemVerilog, Python, TCL).
 * Knowledge of DRAM/HBM systems and JEDEC standards preferred.

Preferred Qualifications

 * 15+ years of relevant SoC design experience with increasing scope and technical leadership.
 * Demonstrated success driving multiple tape-outs and cross-functional SoC programs.
 * Strong leadership, communication, and organizational influence skills.
 * Experience building and managing global engineering teams.

## Description

As a Director of Custom HBM Design and Architecture, you will lead a team responsible for the design, integration, and delivery of next-generation HBM SoC logic die for AI/ML applications. You will drive technical strategy and execution across multiple product generations, working closely with architecture, design, verification, physical design, firmware, and product engineering teams. (LLM), * Analyze hardware and software interaction at the system level to identify bottlenecks in existing AI/ML workloads and HBM-based hardware.

 * Drive future HBM architecture, design, and technology to address bottlenecks, including implementing proof of concept designs.
 * Drive translation of architectural and micro-architectural specifications into robust, high-quality RTL implementations across multiple teams.
 * Own RTL design deliverables across the lifecycle, from RTL development through integration, validation, and silicon bring-up.
 * Drive trade-offs across performance, power, area, schedule, and risk, ensuring optimal product outcomes.
 * Proactively identify execution risks and implement mitigation strategies across teams and design phases.
 * Build, lead, and scale a high-performing RTL design and integration team, including recruiting, mentoring, and retention of top engineering talent.
 * Set technical direction and expectations, enabling engineers to execute complex designs with high quality and efficiency.
 * Foster a culture of innovation, accountability, and continuous improvement aligned with organizational values.
 * Develop future technical leaders and strengthen organizational capabilities in HBM SoC design.