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# Module Development Engineer (Ph.D.) - Intel Foundry

- **Company:** Intel Corporation
- **Location:** Hillsboro, OR, United States
- **Experience:** Expert
- **Salary:** $133,800.0 - $188,890.0
- **Contract:** Internship / Graduate position
- **Skills:** Data Analysis, C Sharp (Programming Language), Computer Engineering, Python (Programming Language), MATLAB, Software Tools, Statistical Process Control (SPC), Scripting, JMP (Statistical Software), Software Modules, Data Analytics, BIG-IP Advanced Firewall Manager (AFM), Stable Diffusion
- **Published:** October 22, 2026
- **Apply:** https://www.techcareers.com/job.asp?id=3474066933&tx=FL434FFF&pt=1&aff=0B19D771-A501-4A5E-8338-2A822B784D54&utm_source=Job%20Feed&utm_medium=textkernel&utm_campaign=DE&utm_term=0B19D771-A501-4A5E-8338-2A822B784D54

## About the Role

Candidates must meet the following criteria (relevant experience may be gained through academic coursework, laboratory research, thesis work, internships, post doc, or publications), * Education: Ph.D. in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, Physics, Mechanical, Chemistry, or a related STEM field (expected completion prior to start date).

 * Hands-on Experience: 6+ months of experience with semiconductor fabrication, process development, device research, materials research, or related semiconductor technology, including one or more of the following: lithography (Litho)/overlay, epitaxy (EPI), wet etch, dry etch, thin-film deposition, diffusion, ion implantation, CMP/planarization, metals/metallization, dielectrics, metrology, process integration, yield, or electrical characterization., * Environment & Tooling: 6+ months in a cleanroom or semiconductor research lab working directly with fabrication or analytical instrumentation (e.g., ALD, CVD, PVD, plasma etch, CD-SEM, TEM, AFM, spectroscopic ellipsometry).
 * Data Science & Automation: 6+ months utilizing statistical methodologies (DOE, SPC) and engineering software/scripting languages (Python, MATLAB, JMP, C#, or equivalents) for data analysis and automation.
 * Device Physics & Integration: Academic or research specialization in transistor architecture, advanced semiconductor materials, or FEOL/BEOL process integration.
 * Technical Dissemination: Proven track record of presenting technical findings through dissertations, peer-reviewed publications, conference proceedings, patents, or white papers.

## Description

Intel Logic Technology Development (LTD) designs and scales the advanced semiconductor process technologies that power future generations of Intel architecture., As a Module Development Engineer , you will drive the development, optimization, characterization, and high-volume manufacturing (HVM) transfer of leading-edge semiconductor processes.

 * Patterning & Removal: Lithography, Overlay, Wet Etch, Dry/Plasma Etch, Chemical Mechanical Planarization (CMP).
 * Thin Films & Doping: Epitaxy (EPI), Thin-Film Deposition (ALD/CVD/PVD), Diffusion, Ion Implantation, Metals/Metallization, Dielectrics.
 * Metrology, Yield & Integration: In-line Metrology, FEOL/BEOL Process Integration, Defect Reduction, Yield Analysis, Electrical Characterization., * Process & Hardware Engineering: Design, execute, and optimize experimental runs to advance semiconductor processes, equipment hardware, and new material capabilities.
 * Process Control & Data Analytics: Apply statistical modeling, Design of Experiments (DOE), and control systems (SPC, APC, Run-to-Run) to reduce variability, mitigate defects, and drive yield enhancement.
 * Cross-Functional & Vendor Collaboration: Partner with external tool/material suppliers and internal integration teams to co-develop cutting-edge equipment and process methodologies.
 * HVM Technology Transfer: Resolve equipment, process, and yield excursion root causes to ensure smooth, robust technology transfer from development into high-volume manufacturing.
 * Documentation & Technical Reporting: Document experimental findings, operating procedures, and technical recommendations through engineering reports and presentations.